Hitachi H8/3152 Hardware Manual page 13

Note: This figure shows the relative locations of the bonding pads
6
CLK
RES
V
CC
on the chip. For accurate locations and chip dimensions,
refer to the separately supplied specifications.
Figure 1.3 Bonding Pad Arrangement
I/O-1/IRQ
I/O-2/IRQ
V
SS
User PAD