Figure 34. Recommended Pcb Design Rules For Pads (0.5 Mm Pitch Bga) - STMicroelectronics STM32L151CB Manual

STM32L151xx, STM32L152xx

Figure 34. Recommended PCB design rules for pads (0.5 mm pitch BGA)

1. Non solder mask defined (NSMD) pads are recommended
2. 4 to 6 mils solder paste screen printing process
Dpad
Dsm
Doc ID 17659 Rev 6
Package characteristics
Pitch 0.5 mm
D pad 0.27 mm
0.35 mm typ (depends on
Dsm
the soldermask registration
tolerance)
Solder paste 0.27 mm aperture diameter
ai15495
99/109