Figure 33. Tfbga64 - 8 X 8 Active Ball Array, 5 X 5 Mm, 0.5 Mm Pitch, Package Outline - STMicroelectronics STM32L151CB Manual

Package characteristics

Figure 33. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package outline

1. Drawing is not to scale.
Table 59.
Symbol
A
A1
A2
A3
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
1. Values in inches are converted from mm and rounded to 4 decimal digits.
98/109
A
A1
A3
A4
A2
Seating
C
plane
TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package
mechanical data
millimeters
Min Typ
0.150
0.785
0.200
0.250 0.300
4.850 5.000
3.500
4.850 5.000
3.500
0.500
0.750
0.080
0.150
0.050
Doc ID 17659 Rev 6
B D
D1
e
H
G
F
E
D
C
B
A
1 2 3 4 5
A1 ball pad corner Øb (64 balls)
Bottom view
Max Min
1.200
0.0059
0.600
0.350 0.0098
5.150 0.1909
5.150 0.1909
STM32L151xx, STM32L152xx
A
F
F
E1 E
e
6 7 8
ME_R8
(1)
inches
Typ
0.0309
0.0079
0.0118
0.1969
0.1378
0.1969
0.1378
0.0197
0.0295
0.0031
0.0059
0.0020
Max
0.0472
0.0236
0.0138
0.2028
0.2028