Figure 31. Ufqfpn48 7 X 7 Mm, 0.5 Mm Pitch, Package Outline; Figure 32. Recommended Footprint (Dimensions In Mm) (1); Pitch Package Mechanical Data - STMicroelectronics STM32L151CB Manual

STM32L151xx, STM32L152xx
Figure 31. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package
(1)(2)(3)
outline
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this
back-side pad to PCB ground.
Table 58.
Symbol
A
A1
D
E
L
T
b
e
1. Values in inches are converted from mm and rounded to 4 decimal digits.
UFQFPN48 – ultra thin fine pitch quad flat pack no-lead 7 × 7 mm, 0.5 mm

pitch package mechanical data

millimeters
Typ Min
0.500 0.550
0.000 0.020
6.900 7.000
6.900 7.000
0.300 0.400
0.152
0.200 0.250
0.500
Doc ID 17659 Rev 6
Figure 32. Recommended footprint
(dimensions in mm)
48
1
0.20
7.30
0.30
12
13
0.55
Max Typ
0.600 0.0197
0.050 0.0000
7.100 0.2717
7.100 0.2717
0.500 0.0118
0.300 0.0079
Package characteristics
(1)
7.30
37
36
6.20
6.20 5.60 5.80
5.60
25
24
0.75
0.50
5.80
ai15697
(1)
inches
Min Max
0.0217 0.0236
0.0008 0.0020
0.2756 0.2795
0.2756 0.2795
0.0157 0.0197
0.0060
0.0098 0.0118
0.0197
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