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6.2.1.3
Pressure Drop
Figure 6-4
reference thermal solution.
at the recommended airflow through a reference heatsink. This ensures cooling
requirements for the system components downstream from the processor are met
while ensuring the processor thermal targets are met.
.
Figure 6-4.
Reference Heatsink Pressure Drop Curve
6.2.2
Thermal Solution Performance Characterization
The following equations can be used to calculate the thermal resistances. Refer to
Table 6-3
Power only the CPU, no power to the MCDRAMs or fabric:
Power only the MCDRAMs, no power to the CPU or fabric:
Power only the fabric, no power to the CPU or MCDRAMs:
®
®
Intel
Xeon
Phi™ Processor x200 Product Family TMSDG
50
illustrates the relationship of pressure drop to volumetric air flow for the
Table 6-7
for definitions.
cc
= (T
mc
= (T
cm
= (T
mm
= (T
cf
= (T
mf
Thermal Specifications and Design Guidelines
provides the expected value for the pressure drop
= (T
– T
) / P
case_CPU
LA
CPU
– T
) / P
case_MCDRAM
LA
– T
) / P
case_CPU
LA
MCDRAM
– T
) / P
case_MCDRAM
LA
– T
) / P
case_CPU
LA
Fabric
– T
) / P
case_MCDRAM
LA
CPU
MCDRAM
Fabric
Order Number: 334785-002
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