Processor Package Carrier; Processor With Fabric Package Carrier - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual

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Retention Assembly Mechanical Design
.
Figure 4-3.

Processor Package Carrier

Figure 4-4.

Processor with Fabric Package Carrier

The keying features on the carrier ensure the processor package snaps into the carrier
in only one way, and the carrier itself can be attached to the heatsink in only one
orientation.
Order Number: 334785-002
Package
Clip
Pin A1
Alignment
Package
Mark
Alignment
Feature
Package
Fabric End
Alignment Clip
Pin A1
Alignment
Package
Mark
Alignment
Feature
®
Intel Xeon
Heatsink
Alignment
And Attach
Clips
Heatsink
Alignment
And Attach
Clips
®
Phi™ Processor x200 Product Family TMSDG
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