Table of Contents
Advertisement
Socket Mechanical Design
3.6
Orientation in Packaging, Shipping, and Handling
Packaging media supports high-volume manufacturing. Media design will be such that
no component of the socket (solder balls, contacts, housing, and so on) is damaged
during shipping and handling. Each part number will be shipped from suppliers in
separate Joint Electron Device Engineering Council (JEDEC) trays; for example, all left
halves of the socket in one tray and all right halves in another. Tray height could be
taller than standard.
3.7
Pick-and-Place and Dust Cover
The pick-and-place cover retention will be sufficient to support the socket weight during
lifting, translation, and placement. The pick-and-place cover removal force should not
exceed 1.7 lbf in the horizontal direction, during manual operation. The pick-and-place
cover ergonomics requirements are listed in
The pick-and-place cover will have openings so that the Pin A1 and keying inserts are
visible. To facilitate high-volume manufacturing, the socket should have a detachable
cover to support the vacuum type pick-and-place system. The cover will remain on the
socket during reflow to help prevent contamination. The cover can withstand 260 °C for
40 seconds (typical reflow/rework profile) without degrading.
The cover design should allow use of a tool to remove the cover. The force required for
removing of the cover should comply with the applicable requirements of SEMI S8-
0999 Safety Guidelines for Ergonomics/Human Factors Engineering of Semiconductor
Manufacturing Equipment. The removal of the cover should not cause any damage to
the socket body nor to the cover itself.
A separate socket dust cover, a single part covering both halves of the socket, is
provided for use after socket and main board integration for use as a protective device
to prevent damage to the contact field during handling. See
Appendix
3.7.1
Socket and Pick-and-Place Cover Durability
The socket will withstand 30 cycles of processor insertion and removal. The maximum
part average and single pin resistances must be met when mated in the 1st through
30th cycles.
The socket pick-and-place cover will withstand 15 cycles of insertion and removal.
3.8
Keep-In/Keep-Out Zone
Socket keep-in and keep-out zones are identified on the main board to ensure that
sufficient space is available for socket placement and to prevent interference between
the socket and other components on the main board. These areas are illustrated in
Appendix
deviation from design guidance identified here.
Order Number: 334785-002
E-28.
F. It is the responsibility of the socket supplier to identify any required
Table
3-3.
Appendix E-27
®
®
Intel
Xeon
Phi™ Processor x200 Product Family TMSDG
and
31
Advertisement
Table of Contents
