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Board and System Design Guidelines
5.2.5
Board Deflection
Exceeding the maximum Board Deflection called out in
solder joint failure. Board deflection under the LGA3647-1 socket will be kept to an
acceptable level by adhering to the following conditions:
1. Following the design objectives of the Intel reference heatsink and back plate
2. Maintaining compliance to maximum static compressive load values
Placement of board-to-chassis mounting holes also impacts board deflection and
resultant socket solder ball stress. Customers should explore the impact of mechanical
shock for their designs as their heatsink retention, heatsink mass and chassis mounting
holes may vary.
5.3
Fabric Cable Assembly Design Guidance
This section applies only to designs supporting the processor with fabric.
• CPU Package Mechanical Design: Refer to
processor with fabric package design details.
• Socket-P1 (LGA3647-1): The same socket supports both the processor and the
processor with fabric. There are no additional socket design issues to consider.
• Mechanical Retention Assembly Design: Refer to
processor with fabric mechanical retention assembly design details. Note that only
the carrier differs for the two variations of the processor package (with and without
fabric).
In addition to the processor with fabric package and carrier differences noted above,
the designer also should consider how the fabric interface is connected in the platform.
This connection is accomplished using the Intel Fabric Passive (IFP) cable. Additional
IFP cable-specific design information may be included in a future revision of this design
guide.
Order Number: 334785-002
Table 3-2
Section 2
and
Appendix C
Section 4
and
®
®
Intel
Xeon
Phi™ Processor x200 Product Family TMSDG
may result in socket
for the
Appendix E
for the
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