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Intel Xeon 5500 Series Design Manual

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Intel® Xeon® Processor 5500 Series
Thermal/Mechanical Design Guide
March 2009
Document Number:321323-001

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Summary of Contents for Intel Xeon 5500 Series

  • Page 1 Intel® Xeon® Processor 5500 Series Thermal/Mechanical Design Guide March 2009 Document Number:321323-001...
  • Page 2 The Intel® Xeon® processor 5500 series and LGA1366 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

  • Page 3: Table Of Contents

    5.6.1 Fan Speed Control .................. 39 5.6.2 PECI Averaging and Catastrophic Thermal Management....... 40 5.6.3 Intel® Turbo Boost Technology ..............40 Thermal Guidance ..................... 40 5.7.1 Thermal Excursion Power for 95 W Processor ..........40 5.7.2 Thermal Excursion Power for 80 W Processor ..........41 5.7.3...
  • Page 4 Mechanical Drawings and Supplier Information ............92 Processor Installation Tool ..................97 Figures 1-1 Intel® Xeon® 5500 Platform Socket Stack ..............9 2-1 LGA1366 Socket with Pick and Place Cover Removed ............13 2-2 LGA1366 Socket Contact Numbering (Top View of Socket) ..........14 2-3 LGA1366 Socket Land Pattern (Top View of Board) ............15...
  • Page 5 C-3 Socket Mechanical Drawing (Sheet 3 of 4) ..............82 C-4 Socket Mechanical Drawing (Sheet 4 of 4) ..............83 D-1 Intel® Xeon® Processor 5500 Series Load Cell Fixture..........86 E-1 ATCA Heatsink Performance Curves ................88 E-2 NEBS Thermal Profile....................89 E-3 UP ATCA Thermal Solution..................
  • Page 6 Guidance ....................39 CONTROL 6-1 Heatsink Test Conditions and Qualification Criteria ............43 A-1 Suppliers for the Intel Reference Thermal Solution ............47 A-2 Suppliers for the Intel Collaboration Thermal Solution ...........48 A-3 Suppliers for the Alternative Thermal Solution ..............48 A-4 LGA1366 Socket and ILM Components ................49 B-1 Mechanical Drawing List ....................51...

  • Page 7: Revision History

    Revision History Document Number Revision Number Description Revision Date 321323 Public Release March 2009 § Thermal/Mechanical Design Guide...
  • Page 8 Thermal/Mechanical Design Guide...

  • Page 9: Introduction

    Introduction This document provides guidelines for the design of thermal and mechanical solutions for 2-socket server and 2-socket Workstation processors in the Intel® Xeon® 5500 Platform. The processors covered include those listed in the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 and the follow-on processors. The design guidelines apply to the follow-on processors in their current stage of development and are not expected to change as they mature.

  • Page 10: References

    The processor mates with the system board through this surface mount, 1366-contact socket. PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices. Case-to-ambient thermal characterization parameter (psi). A measure of thermal Ψ...
  • Page 11 Introduction Table 1-2. Terms and Descriptions (Sheet 2 of 2) Term Description is a static value below TCC activation used as a trigger point for fan speed CONTROL CONTROL control. Thermal Design Power: Thermal solution should be designed to dissipate this target power level.
  • Page 12 Introduction Thermal/Mechanical Design Guide...

  • Page 13: Lga1366 Socket

    LGA1366 Socket This chapter describes a surface mount, LGA (Land Grid Array) socket intended for processors in the Intel® Xeon® 5500 Platform. The socket provides I/O, power and ground contacts. The socket contains 1366 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.

  • Page 14: Lga1366 Socket Contact Numbering (Top View Of Socket)

    LGA1366 Socket Figure 2-2. LGA1366 Socket Contact Numbering (Top View of Socket) Thermal/Mechanical Design Guide...

  • Page 15: Board Layout

    LGA1366 Socket Board Layout The land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size is 18 mils. Note that there is no round-off (conversion) error between socket pitch (1.016 mm) and board pitch (40 mil) as these values are equivalent. Figure 2-3.

  • Page 16: Attachment To Motherboard

    LGA1366 Socket Attachment to Motherboard The socket is attached to the motherboard by 1366 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket. As indicated in Figure 2-4, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process.

  • Page 17: Contacts

    LGA1366 Socket The co-planarity (profile) and true position requirements are defined in Appendix 2.3.3 Contacts Base material for the contacts is high strength copper alloy. For the area on socket contacts where processor lands will mate, there is a 0.381 μm [15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel underplate.

  • Page 18: Package Installation / Removal

    LGA1366 Socket Package Installation / Removal As indicated in Figure 2-6, access is provided to facilitate manual installation and removal of the package. To assist in package orientation and alignment with the socket: • The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for proper orientation.

  • Page 19: Durability

    LGA1366 Socket Durability The socket must withstand 30 cycles of processor insertion and removal. The max chain contact resistance from Table 4-4 must be met when mated in the 1st and 30th cycles. The socket Pick and Place cover must withstand 15 cycles of insertion and removal. Markings There are three markings on the socket: •...

  • Page 20: Lga1366 Socket Nctf Solder Joints

    LGA1366 Socket LGA1366 Socket NCTF Solder Joints Intel has defined selected solder joints of the socket as non-critical to function (NCTF) for post environmental testing. The processor signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality.

  • Page 21: Independent Loading Mechanism (Ilm)

    Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be “build to print” from Intel controlled drawings. Intel recommends using the Intel Reference ILM.

  • Page 22: Ilm Back Plate Design Overview

    An additional cut-out on two sides provides clearance for backside voltage regulator components. An insulator is pre- applied. Back plates for processors in 1-socket Workstation platforms are covered in the Intel® Xeon® Processor 3500 Series Thermal/Mechanical Design Guide. Thermal/Mechanical Design Guide...

  • Page 23: Assembly Of Ilm To A Motherboard

    Independent Loading Mechanism (ILM) Figure 3-2. Back Plate Threaded studs Threaded studs Threaded studs Clearance hole Clearance hole Clearance hole Threaded nuts Threaded nuts Threaded nuts Assembly of ILM to a Motherboard The ILM design allows a bottoms up assembly of the components to the board. In step 1, (see Figure 3-3), the back plate is placed in a fixture.

  • Page 24: Ilm Assembly

    Independent Loading Mechanism (ILM) Figure 3-3. ILM Assembly Step 2: With back plate against bottom of Step 2: With back plate against bottom of board, align ILM cover assembly to back board, align ILM cover assembly to back Step 1: With socket body reflowed on Step 1: With socket body reflowed on plate studs.

  • Page 25: Pin1 And Ilm Lever

    Independent Loading Mechanism (ILM) As indicated in Figure 3-4, socket protrusion and ILM key features prevent 180-degree rotation of ILM cover assembly with respect to the socket. The result is a specific Pin 1 orientation with respect to the ILM lever. Figure 3-4.
  • Page 26 Independent Loading Mechanism (ILM) Thermal/Mechanical Design Guide...

  • Page 27: Lga1366 Socket And Ilm Electrical, Mechanical, And Environmental Specifications

    The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance. To ensure socket long term reliability, Intel defines socket maximum temperature using a via on the underside of the motherboard. Exceeding the...

  • Page 28: Loading Specifications

    This is the minimum and maximum static force that can be applied by the heatsink and it’s retention solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated to these limits.

  • Page 29: Environmental Requirements

    LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications Table 4-4. Electrical Requirements for LGA1366 Socket Parameter Value Comment Mated loop inductance, Loop The inductance calculated for two contacts, considering one forward conductor and one return <3.9nH conductor. These values must be satisfied at the worst-case height of the socket.

  • Page 30: Flow Chart Of Knowledge-Based Reliability Evaluation Methodology

    Freeze stressing Perform stressing to requirements and perform validate accelerated additional data turns stressing assumptions and determine acceleration factors A detailed description of this methodology can be found at: ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf. § Thermal/Mechanical Design Guide...

  • Page 31: Thermal Solutions

    This section describes a 1U reference heatsink, design targets for 2U and Tower heatsinks, performance expectations for a 25.5 mm tall heatsink, and thermal design guidelines for Intel® Xeon® Processor 5500 Series and the follow-on processors. Performance Targets Table 5-1 provides boundary conditions and performance targets for 1U, 2U and Tower heatsinks.

  • Page 32: Heatsink Performance Curves

    Thermal Solutions For 1U reference heatsink, see Appendix B for detailed drawings. Table 5-1 specifies and pressure drop targets at 9.7 CFM. Figure 5-1 shows Ψ and pressure drop for Ψ the 1U heatsink versus the airflow provided. Best-fit equations are provided to prevent errors associated with reading the graph.

  • Page 33: 25.5 Mm Tall Heatsink

    Thermal Solutions 5.1.1 25.5 mm Tall Heatsink For the 25.5 mm tall heatsink, Table 5-2 provides guidance regarding performance expectations. These values are not used to generate processor thermal specifications. Table 5-2. Performance Expectations for 25.5 mm Tall Heatsink Parameter Value Altitude, system Sea level, 35...

  • Page 34: Heat Pipe Considerations

    Thermal Solutions Heat Pipe Considerations Figure 5-2 shows the orientation and position of the TTV die. The TTV die is sized and positioned similarly to the processor die. Figure 5-2. TTV Die Size and Orientation Figure 1 - Side Views of Package with IHS (not to scale) Cache Cache Cache Cache Cache Die CL...

  • Page 35: Assembly

    Thermal Solutions Assembly Figure 5-3. 1U Reference Heatsink Assembly 1U Reference Heatsink 1U Reference Heatsink Captive Screw Captive Screw Thermal Interface Material: Thermal Interface Material: Honeywell PCM45F Honeywell PCM45F IHS: Integrated IHS: Integrated Heat Spreader Heat Spreader Threaded Nut Threaded Nut Reference Back Plate Reference Back Plate (Unified Back Plate)

  • Page 36: Thermal Interface Material (Tim)

    The heatsink limit of 500 gm and use of back plate have eliminated the need for Direct Chassis Attach retention (as used previously with the Intel® Xeon® processor 5000 sequence). Direct contact between back plate and chassis pan will help minimize board deflection during shock.

  • Page 37: Dual Thermal Profile

    Thermal Solutions Figure 5-4. Processor Thermal Characterization Parameter Relationships 5.5.2 Dual Thermal Profile Processors that offer dual thermal profile are specified in the appropriate Datasheet. Dual thermal profile helps mitigate limitations in volumetrically constrained form factors and allows trade-offs between heatsink cost and TCC activation risk. For heatsinks that comply to Profile B, yet do not comply to Profile A (1U heatsink in Figure 5-5), the processor has an increased probability of TCC activation and an...

  • Page 38: Thermal Features

    Thermal Solutions Figure 5-5. Dual Thermal Profile _MAX_B CASE _MAX_A CASE 1U Heatsink 2U Heatsink POWER Compliance to Profile A ensures that no measurable performance loss will occur due to TCC activation. It is expected that TCC would only be activated for very brief periods of time when running a worst-case real world application in a worst-case thermal condition.

  • Page 39: Fan Speed Control

    Guidance can reduce average fan power CONTROL and improve acoustics. Implementation is optional. Alternately, the factory configured values can still be used. There are no plans to change Intel's specification or CONTROL the factory configured T values on individual processors.

  • Page 40: Peci Averaging And Catastrophic Thermal Management

    5.6.3 Intel® Turbo Boost Technology Intel® Turbo Boost Technology (Intel® TBT) is a new feature available on certain processor SKUs that opportunistically, and automatically, allows the processor to run faster than the marked frequency if the part is operating below its power, temperature and current limits.

  • Page 41: Thermal Excursion Power For 80 W Processor

    Absolute Processor Temperature Intel does not test any third party software that reports absolute processor temperature. As such, Intel cannot recommend the use of software that claims this capability. Since there is part-to-part variation in the TCC (thermal control circuit) activation temperature, use of software that reports absolute temperature can be misleading.
  • Page 42 Thermal Solutions Thermal/Mechanical Design Guide...

  • Page 43: Quality And Reliability Requirements

    Drop height determined by weight and may No visual defects 1 box Packaged Shock vary by customer; Intel requirement in General Supplier Packaging Spec. 10 drops (6 sides, 3 edges, 1 corner) 6) Shipping Media: 0.015 g2/Hz @ 10-40 Hz, sloping to...
  • Page 44 + 3s + offset not to exceed heatsinks X Table 5-1 value for Tower. 3) TTV @ 80W. 3 tests by Intel. 4) TTV @ 60W. Using Tower heatsink and Tower airflow from Table 5-1: 5) TTV @ 130W, Note 1.

  • Page 45: Intel Reference Component Validation

    Example Thermal Cycle - Actual profile will vary Intel Reference Component Validation Intel tests reference components both individually and as an assembly on mechanical test boards, and assesses performance to the envelopes specified in previous sections by varying boundary conditions.

  • Page 46: Recommended Bios/Processor/Memory Test Procedures

    Quality and Reliability Requirements 2. Heatsink remains seated and its bottom remains mated flat against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware. 3.

  • Page 47: A Component Suppliers

    Table A-4. A.1.1 Intel Reference Thermal Solution The Intel reference thermal solutions has been verified to meet the criteria outlined in Table 6-1. Customers can purchase the Intel reference thermal solutions from the suppliers listed in Table A-1.

  • Page 48: Alternative Thermal Solution

    Harry Lin hlinack@aol.com 714 739-5797 A.1.3 Alternative Thermal Solution The alternative thermal solutions are preliminary and are not verified by Intel to meet the criteria outlined in Table 6-1. Customers can purchase the alternative thermal solutions from the suppliers listed in Table A-3.

  • Page 49: Socket And Ilm Components

    Supplier Contact Info Assembly, 2U Alternative URS Supplier Designed Asia Vital Asia Vital Components (AVC) Heatsink, Heatsink Solution, Components (AVC) Intel® Xeon® Aluminum base, SR40400001 David Chao Processor 5500 Cu insert, Al fins, david_chao@avc.com.tw Series, 2U heatpipes, includes TIM, 95W...
  • Page 50 Component Suppliers Thermal/Mechanical Design Guide...

  • Page 51: Mechanical Drawings

    Mechanical Drawings Mechanical Drawings Table B-1. Mechanical Drawing List Description Figure Board Keepin / Keepout Zones (Sheet 1 of 4) Figure B-1 Board Keepin / Keepout Zones (Sheet 2 of 4) Figure B-2 Board Keepin / Keepout Zones (Sheet 3 of 4) Figure B-3 Board Keepin / Keepout Zones (Sheet 4 of 4) Figure B-4...

  • Page 52: Board Keepin / Keepout Zones (Sheet 1 Of 4)

    Mechanical Drawings Figure B-1. Board Keepin / Keepout Zones (Sheet 1 of 4) Thermal/Mechanical Design Guide...

  • Page 53: Board Keepin / Keepout Zones (Sheet 2 Of 4)

    Mechanical Drawings Figure B-2. Board Keepin / Keepout Zones (Sheet 2 of 4) 3.346 [ 85.00 3.150 [ 80.00 2.854 [ 72.50 2.665 [ 67.70 2.2835 [ 58.000 1.856 [ 47.15 1.293 [ 32.85 0.8661 [ 22.000 BALL 0.755 [ 19.17 0.484 [ 12.30...

  • Page 54: Board Keepin / Keepout Zones (Sheet 3 Of 4)

    Mechanical Drawings Figure B-3. Board Keepin / Keepout Zones (Sheet 3 of 4) 0.197 [ 5.00 0.000 [ 0.00 0.374 [ 9.50 1.293 [ 32.85 1.856 [ 47.15 2.776 [ 70.50 3.346 [ 85.00 Thermal/Mechanical Design Guide...

  • Page 55: Board Keepin / Keepout Zones (Sheet 4 Of 4)

    Mechanical Drawings Figure B-4. Board Keepin / Keepout Zones (Sheet 4 of 4) Thermal/Mechanical Design Guide...

  • Page 56: Reference Heatsink Assembly (Sheet 1 Of 2)

    Mechanical Drawings Figure B-5. 1U Reference Heatsink Assembly (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 57: Reference Heatsink Assembly (Sheet 2 Of 2)

    Mechanical Drawings Figure B-6. 1U Reference Heatsink Assembly (Sheet 2 of 2) Thermal/Mechanical Design Guide...

  • Page 58: B-7 1U Reference Heatsink Fin And Base (Sheet 1 Of 2)

    Mechanical Drawings Figure B-7. 1U Reference Heatsink Fin and Base (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 59: B-8 1U Reference Heatsink Fin And Base (Sheet 2 Of 2)

    Mechanical Drawings Figure B-8. 1U Reference Heatsink Fin and Base (Sheet 2 of 2) Thermal/Mechanical Design Guide...

  • Page 60: Heatsink Shoulder Screw (1U, 2U And Tower)

    Mechanical Drawings Figure B-9. Heatsink Shoulder Screw (1U, 2U and Tower) Thermal/Mechanical Design Guide...

  • Page 61: B-10Heatsink Compression Spring (1U, 2U And Tower)

    Mechanical Drawings Figure B-10. Heatsink Compression Spring (1U, 2U and Tower) Thermal/Mechanical Design Guide...

  • Page 62: B-11Heatsink Retaining Ring (1U, 2U And Tower)

    Mechanical Drawings Figure B-11. Heatsink Retaining Ring (1U, 2U and Tower) Thermal/Mechanical Design Guide...

  • Page 63: B-12Heatsink Load Cup (1U, 2U And Tower)

    Mechanical Drawings Figure B-12. Heatsink Load Cup (1U, 2U and Tower) Thermal/Mechanical Design Guide...

  • Page 64: B-132U Collaborative Heatsink Assembly (Sheet 1 Of 2)

    Mechanical Drawings Figure B-13. 2U Collaborative Heatsink Assembly (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 65: B-142U Collaborative Heatsink Assembly (Sheet 2 Of 2)

    Mechanical Drawings Figure B-14. 2U Collaborative Heatsink Assembly (Sheet 2 of 2) Thermal/Mechanical Design Guide...

  • Page 66: B-152U Collaborative Heatsink Volumetric (Sheet 1 Of 2)

    Mechanical Drawings Figure B-15. 2U Collaborative Heatsink Volumetric (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 67: B-162U Collaborative Heatsink Volumetric (Sheet 2 Of 2)

    Mechanical Drawings Figure B-16. 2U Collaborative Heatsink Volumetric (Sheet 2 of 2) Thermal/Mechanical Design Guide...

  • Page 68: B-17Tower Collaborative Heatsink Assembly (Sheet 1 Of 2)

    Mechanical Drawings Figure B-17. Tower Collaborative Heatsink Assembly (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 69: B-18Tower Collaborative Heatsink Assembly (Sheet 2 Of 2)

    Mechanical Drawings Figure B-18. Tower Collaborative Heatsink Assembly (Sheet 2 of 2) Thermal/Mechanical Design Guide...

  • Page 70: B-19Tower Collaborative Heatsink Volumetric (Sheet 1 Of 2)

    Mechanical Drawings Figure B-19. Tower Collaborative Heatsink Volumetric (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 71: B-20Tower Collaborative Heatsink Volumetric (Sheet 2 Of 2)

    Mechanical Drawings Figure B-20. Tower Collaborative Heatsink Volumetric (Sheet 2 of 2) Thermal/Mechanical Design Guide...

  • Page 72: B-211U Reference Heatsink Assembly With Tim (Sheet 1 Of 2)

    Mechanical Drawings Figure B-21. 1U Reference Heatsink Assembly with TIM (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 73: B-221U Reference Heatsink Assembly With Tim (Sheet 2 Of 2)

    Mechanical Drawings Figure B-22. 1U Reference Heatsink Assembly with TIM (Sheet 2 of 2) Thermal/Mechanical Design Guide...

  • Page 74: B-232U Reference Heatsink Assembly With Tim (Sheet 1 Of 2)

    Mechanical Drawings Figure B-23. 2U Reference Heatsink Assembly with TIM (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 75: B-242U Reference Heatsink Assembly With Tim (Sheet 2 Of 2)

    Mechanical Drawings Figure B-24. 2U Reference Heatsink Assembly with TIM (Sheet 2 of 2) Thermal/Mechanical Design Guide...

  • Page 76: B-25Tower Reference Heatsink Assembly With Tim (Sheet 1 Of 2)

    Mechanical Drawings Figure B-25. Tower Reference Heatsink Assembly with TIM (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 77: B-26Tower Reference Heatsink Assembly With Tim (Sheet 2 Of 2)

    Mechanical Drawings Figure B-26. Tower Reference Heatsink Assembly with TIM (Sheet 2 of 2) § Thermal/Mechanical Design Guide...
  • Page 78 Mechanical Drawings Thermal/Mechanical Design Guide...

  • Page 79: C Socket Mechanical Drawings

    Socket Mechanical Drawings Socket Mechanical Drawings Table C-1 lists the mechanical drawings included in this appendix. Table C-1. Mechanical Drawing List Drawing Description Figure Number “Socket Mechanical Drawing (Sheet 1 of 4)” Figure C-1 “Socket Mechanical Drawing (Sheet 2 of 4)” Figure C-2 “Socket Mechanical Drawing (Sheet 3 of 4)”...

  • Page 80: Socket Mechanical Drawing (Sheet 1 Of 4)

    Socket Mechanical Drawings Figure C-1. Socket Mechanical Drawing (Sheet 1 of 4) Thermal/Mechanical Design Guide...

  • Page 81: Socket Mechanical Drawing (Sheet 2 Of 4)

    Socket Mechanical Drawings Figure C-2. Socket Mechanical Drawing (Sheet 2 of 4) Thermal/Mechanical Design Guide...

  • Page 82: Socket Mechanical Drawing (Sheet 3 Of 4)

    Socket Mechanical Drawings Figure C-3. Socket Mechanical Drawing (Sheet 3 of 4) Thermal/Mechanical Design Guide...

  • Page 83: Socket Mechanical Drawing (Sheet 4 Of 4)

    Socket Mechanical Drawings Figure C-4. Socket Mechanical Drawing (Sheet 4 of 4) § Thermal/Mechanical Design Guide...
  • Page 84 Socket Mechanical Drawings Thermal/Mechanical Design Guide...

  • Page 85: D Heatsink Load Metrology

    Heatsink Load Metrology Heatsink Load Metrology To ensure compliance to max socket loading value listed in Table 4-3, and to meet the performance targets for Thermal Interface Material in Section 5.3, the Heatsink Static Compressive Load can be assessed using the items listed below: •...

  • Page 86: Intel® Xeon® Processor 5500 Series Load Cell Fixture

    Heatsink Load Metrology Figure D-1. Intel® Xeon® Processor 5500 Series Load Cell Fixture § Thermal/Mechanical Design Guide...

  • Page 87: E Embedded Thermal Solutions

    Embedded Thermal Solutions Embedded Thermal Solutions This section describes the LV processors and Embedded reference heatsinks for NEBS (Network Equipment Building Systems) compliant ATCA (Advanced Telecommunications Computing Architecture) systems. These LV processors are good for any form factor that needs to meet NEBS requirements. Performance Targets Table E-1 provides boundary conditions and performance targets for 1U and ATCA...

  • Page 88: Thermal Design Guidelines

    Thermal Design Guidelines E.2.1 NEBS Thermal Profile Processors that offer a NEBS compliant thermal profile are specified in the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1. NEBS thermal profiles help relieve thermal constraints for Short-Term NEBS conditions. To help reliability, processors must meet the nominal thermal profile under standard...

  • Page 89: Custom Heat Sinks For Up Atca

    Power [W] Notes: 1.) The thermal specifications shown in this graph are for reference only. See the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 for the Thermal Profile specifications. In case of conflict, the data in the datasheet supersedes any data in this figure.

  • Page 90: E-3 Up Atca Thermal Solution

    Embedded Thermal Solutions Figure E-3. UP ATCA Thermal Solution Notes: Thermal sample only, retention not production ready. Figure E-4. UP ATCA System Layout Notes: Heat sink should be optimized for the layout. Thermal/Mechanical Design Guide...
  • Page 91 Embedded Thermal Solutions § Figure E-5. UP ATCA Heat Sink Drawing Thermal/Mechanical Design Guide...

  • Page 92: Mechanical Drawings And Supplier Information

    Appendix B for retention and keep out drawings. The part number below represent Intel reference designs for a DP ATCA heatsink. Customer implementation of these components may be unique and require validation by the customer. Customers can obtain these components directly from the supplier below.

  • Page 93: Atca Reference Heat Sink Assembly (Sheet 1 Of 2)

    Embedded Thermal Solutions § Figure E-6. ATCA Reference Heat Sink Assembly (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 94: Atca Reference Heat Sink Assembly (Sheet 2 Of 2)

    Embedded Thermal Solutions § Figure E-7. ATCA Reference Heat Sink Assembly (Sheet 2 of 2) Thermal/Mechanical Design Guide...

  • Page 95: Atca Reference Heatsink Fin And Base (Sheet 1 Of 2)

    Embedded Thermal Solutions § Figure E-8. ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) Thermal/Mechanical Design Guide...

  • Page 96: Atca Reference Heatsink Fin And Base (Sheet 2 Of 2)

    Embedded Thermal Solutions § Figure E-9. ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) § Thermal/Mechanical Design Guide...

  • Page 97: F Processor Installation Tool

    Processor Installation Tool Processor Installation Tool The following optional tool is designed to provide mechanical assistance during processor installation and removal. Contact the supplier for availability: Billy Hsieh billy.hsieh@tycoelectronics.com +81 44 844 8292 Thermal/Mechanical Design Guide...

  • Page 98: Processor Installation Tool

    Processor Installation Tool Figure F-1. Processor Installation Tool § Thermal/Mechanical Design Guide...

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