Heatsink Mechanical Requirements; Heatsink Mechanical Attributes - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual

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4.3

Heatsink Mechanical Requirements

The mass of the heatsink (HS) should not exceed 600 g. The heatsink mass limit and
the use of a back plate have eliminated the need for Direct Chassis Attach retention in
some implementations. Direct contact between back plate and chassis pan will help
minimize board deflection during shock.
Table 4-4.

Heatsink Mechanical Attributes

Attribute
Stiffness 1
Flatness
Base Thickness
Static Load (Max)
Dynamic Load (Max)
Notes:
1. Heatsinks that do not meet or exceed these stiffness specifications will not be capable of providing the long
term loading that the LGA3647 socket requires. These stiffness specifications are related to socket
reliability; any potential thermal impact due to heatsink base deflection at lower stiffness levels needs to be
determined separately.
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Intel Xeon Phi™ Processor x200 Product Family TMSDG
38
Table 4-4
Target
> 600 lbf/mm Short span point load
> 1250 lbf/mm Long span
> 1400 lbf/mm Short span distributed load
0.077 mm (manifesting) Processor local flatness zone in drawing
> 4.5 mm w/ Cu HS base Requires new PHM clip for thickness > 4.5 mm
(reference HS base = 4.5 mm)
< 300 lbf Thermal validation at 200 lbf shown
< 132 lbf Based on 600 g HS. Current HS mass = 424 g
Retention Assembly Mechanical Design
lists heatsink mechanical attributes.
Comments
Order Number: 334785-002