Thermal Solution Performance Characteristics; Cek Heatsink Thermal Performance - Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Design Manual

for structural support and stiffening on the chassis. Intel has published a best known
method (BKM) document that provides specific structural guidance for designing DCA
thermal solutions. The document is titled Chassis Strength and Stiffness Measurement
and Improvement Guidelines for Direct Chassis Attach Solutions.
2.4.5

Thermal Solution Performance Characteristics

Figure 2-17
heatsinks, respectively. These figures show the thermal performance and the pressure
drop through fins of the heatsink versus the airflow provided. The best-fit equations for
these curves are also provided to make it easier for users to determine the desired
value without any error associated with reading the graph.
Figure 2-17. 2U+ CEK Heatsink Thermal Performance
If other custom heatsinks are intended for use with the Quad-Core Intel® Xeon®
Processor 5300 Series, they must support the following interface control requirements
to be compatible with the reference mechanical components:
• Requirement 1: Heatsink assembly must stay within the volumetric keep-in.
• Requirement 2: Maximum mass and center of gravity.
Current maximum heatsink mass is 1000 grams [2.2 lbs] and the maximum center of
gravity 3.81 cm [1.5 in.] above the bottom of the heatsink base.
• Requirement 3: Maximum and minimum compressive load.
Any custom thermal solution design must meet the loading specification as
documented within this document, and should refer to the Quad-Core Intel® Xeon®
Processor 5300 Series Datasheet and LGA771 Socket Mechanical Design Guide and for
specific details on package/socket loading specifications.
42
and Figure 2-18 show the performance of the 2U+ and 1U passive
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
Thermal/Mechanical Reference Design