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Figure 3-1.
LGA3647-1 Socket Assembly with PnP Covers
3.1.1
Socket Features
LGA3647-1 socket attributes are listed in
rectangular pin grid with a hexagonal depopulation region in the center of the array and
selective depopulation elsewhere; see
hexagonal array as shown in
extend above the surface of the socket to make contact with the pads located at the
bottom of the processor package.
Solder balls enable the socket to be surface-mounted to the main board. Each contact
has a corresponding solder ball. Solder ball position may be at an offset with respect to
the contact tip and base. Socket BGA ball hexagonal array ball-out pattern shown in
Figure 3-2
pitch requirements.
Table 3-1.
LGA3647-1 Socket Attributes
Socket Wall Exterior Dimension
Socket Wall Interior Dimension (Package Size)
Pitch (hexagonal pattern)
Ball Count
®
®
Intel
Xeon
Phi™ Processor x200 Product Family TMSDG
20
Figure 3-2
increases contact density by 12% while maintaining 39 mil minimum via
LGA3647-1 Socket
Table
3-1. The socket incorporates a roughly
Appendix
D. The pin field geometry is a
below. The tips of the socket pin contacts
Attributes
82 mm (L) x 62 mm (W)
76.16 mm (L) x 56.6 mm (W)
0.8585 mm (X) x 0.9906 mm (Y)
3647
Socket Mechanical Design
Order Number: 334785-002
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