Offset Between Lga Land Center And Solder Ball Center - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual

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Figure 3-7.

Offset between LGA Land Center and Solder Ball Center

3.3.3.2 Contact Load-Deflection Curve
The contact should be designed with appropriate spring rate and deflection range, as
illustrated by the blue curve in
order to meet BOL (upper boundary) and EOL (lower boundary) performance targets at
all contact locations. Minimum contact normal force should make the contact meet the
electrical requirements. The maximum contact normal force should meet the
specification in
contact deflection at the minimum contact load and the nominal contact deflection.
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Intel Xeon Phi™ Processor x200 Product Family TMSDG
28
Figure 3-8
Table 3-2. The LGA contact working range is defined as the difference of
Socket Mechanical Design
to ensure adequate contact normal force in
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