Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual page 11

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Introduction
Table 1-2. Terms and Terminology (Sheet 2 of 2)
Terms
TDP
TIM
T
LA
T
SA
U
Order Number: 334785-002
Thermal Design Power: The power envelope in which the design is expected to operate
normally without the need for throttling or other performance reduction operational modes.
The thermal solution should be designed to dissipate this target power level. TDP is not the
maximum power that the processor can dissipate.
Thermal Interface Material: The thermally conductive compound between the heatsink and
the processor IHS. This material fills the air gaps and voids, and enhances the transfer of the
heat from the processor IHS to the heatsink.
The local ambient air temperature near the inlet of the thermal solution. This temperature is
usually measured at the upstream air of the heatsink.
The system ambient air temperature external to a system chassis. This temperature is usually
measured at the chassis air inlets.
A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals
3.50 in, and so forth.
Terminology
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Intel Xeon Phi™ Processor x200 Product Family TMSDG
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