Customer Environmental Reliability Testing; Socket Durability Test; Intel Reference Component Validation; Example Mechanical Stress Test: Use Condition Environment Definitions - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual

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Table A-2.

Example Mechanical Stress Test: Use Condition Environment Definitions

Use
Environment
Shipping and Mechanical Shock
Handling • System-level
• Unpackaged test
• Trapezoidal waveform
• 25 g
• velocity change is based on packaged weight.
• Change in velocity is based upon a 0.5 coefficient of
restitution.
Product Weight (lbs)
< 20 lbs
20 to > 40
40 to > 80
80 to < 100
100 to < 120
≥120
Random Vibration
• System-level
• Unpackaged test
• 5 Hz to 500 Hz
— 0.001 g
— ramping to 0.01 g
— constant value of 0.01 g
• Random control limit tolerance is ± 3 dB
• Power Spectral Density (PSD) Profile: 2.20 g RMS
Note: Need to pass customer visual, thermal, mechanical, and electrical requirements.
A.1.1

Customer Environmental Reliability Testing

The conditions of the tests outlined here may differ from the customers' system
requirements. Board/system level requirements are to be identified and performed by
customers planning on using the Intel reference thermal/mechanical solution.
A.1.2

Socket Durability Test

The socket must withstand 30 mating cycles. Test per EIA-364, test procedure 09.
Measure contact resistance when mated in 1st and 30th cycles. The package must be
removed at the end of each de-actuation cycle and reinserted into the socket.
A.1.3

Intel Reference Component Validation

Intel tests reference components individually and as an assembly on mechanical test
boards and assesses performance to the envelopes specified in previous sections by
varying boundary conditions.
While component validation shows a reference design is tenable for a limited range of
conditions, customers need to assess their specific boundary conditions and perform
reliability testing based on their use conditions.
Intel reference components are also used in board functional tests to assess
performance for specific conditions.
® ®
Intel Xeon Phi™ Processor x200 Product Family TMSDG
54
Speculative Stress Condition
Non-palletized Product
Velocity Change (in/sec)
250
225
205
175
145
125
2
/Hz @ 5Hz,
2
/Hz @20 Hz;
2
/Hz from 20 to 500 Hz
Quality and Reliability Requirements
12 drops total Mechanical-induced
brittle solder joint
• 2 drops per each of
failures and TIM
3 perpendicular axes
separation/disbond
• + and - directions
per system total Example mechanisms
include cyclic
• 10 min/axis
mechanical fatigue
• 3 axes
stress and TIM
separation/disbond
Order Number: 334785-002
Purpose/Failure
Mechanism