Table of Contents
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F-3
Processor Heatsink Module Backplate Keep-Out Zone ............................................... 114
Tables
1-1
Related Documents ................................................................................................ 9
1-2
Terms and Terminology .........................................................................................10
2-1
Processor Materials................................................................................................16
3-1
LGA3647-1 Socket Attributes ..................................................................................20
3-2
Socket Loading and Deflection Specifications ............................................................22
3-3
PnP Cover Ergonomics Requirements .......................................................................30
4-1
Bolster Plate Mechanical Load Specifications .............................................................37
4-2
Back Plate Design Criteria ......................................................................................37
4-3
Bolster Plate Design Criteria ...................................................................................37
4-4
Heatsink Mechanical Attributes................................................................................38
5-1
LGA3647-1 Socket and Retention Component Mass ...................................................39
6-1
TDP and T
CASE
6-2
TDP and T
CASE
6-3
Processor T
CASE
6-4
Storage Condition Ratings ......................................................................................48
6-5
TIM Specification...................................................................................................48
6-6
Reference Heatsink Boundary Conditions and Performance Targets ..............................49
6-7
Thermal Solution Performance Design Targets and Environment ..................................49
A-1
Example Thermal Stress Test: Use Condition Environment Definitions ..........................53
A-2
Example Mechanical Stress Test: Use Condition Environment Definitions.......................54
B-1
C-1
Processor Package Drawing List ..............................................................................61
D-1
Socket Drawing List...............................................................................................66
E-1
Mechanical Drawing List .........................................................................................71
F-1
Mechanical Keep-Out Zone Drawing List ................................................................. 111
®
Intel
Xeon Phi™ Processor x200 Product Family TMSDG
6
Specifications - 215W/230W SKUs ......................................................42
Specifications - 245W/260W SKUs ......................................................43
Influence Parameters ......................................................................45
Order Number: 334785-002
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