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Table B-1.
Intel Xeon Phi Processor Platform Thermal/Mechanical Assembly Part
Information
Component
Heatsink
Thermal
Interface
Material
Processor Heatsink Loading Module (PHLM)
Vendor Contact Information for
• Processor Carriers
• Bolster Plate Assemblies
• Back Plate Assemblies
• Socket-P Dust Covers
Processor
Carrier
Processor with
Fabric Carrier
®
®
Intel
Xeon
Phi™ Processor x200 Product Family TMSDG
58
Description
1U Heatsink Assembly; Cu -
Al Reference Heatsink,
washers, nuts and collars.
Intel P/N
Vendor P/N
Thermal Interface Material
PCM45F 70x47x0.25
Intel P/N
Vendor P/N
Plastic processor carrier.
Intel P/N
Lotes P/N
Foxconn P/N
Plastic processor carrier.
Intel P/N
Lotes P/N
Foxconn P/N
Supplier P/N
Supplier Contact Info
Delta*
DELTA ELECTRONICS, INC.
Stephanie Liu
Thermal Management Product BU
(FMBG)
Stephanie.Liu@Delta.com.tw
+886-3-359-1968 #2086
Delta Products Corp
Jason Tsai, Portland, Oregon
jason.fs.tsai@deltaww.com
+1-971-205-7074
H37264-009
DHS-B10780-15
Honeywell*
Honeywell International, Inc.
Connie Smiriglio (Account Manager)
Connie.smiriglio@honeywell.com
+1-845-627-2750
Hyo Xi (Technical)
Hyo.xi@honeywell.com
430 Li Bing Rd,Zhangjiang Hi-Tech
Park,Pudong,SH
Shanghai, 31, 201203, China
+86-21-28943106
H38442-001
099079
Foxconn*
Foxconn Interconnect Technology Inc.
1347 N Alma School Rd Ste 230
Chandler, Arizona USA 85224-5947
Albert Terhune
al.terhune@fit-foxconn.com
+1-480-963-3392
Lotes*
Lotes Guangzhou Co., Ltd.
No. 526 North of Jinling Road
Nansha Economic & Technological
Development Zone, Guangzhou, 511458
China.
Cathy Yang
cathy@lotes.com.cn
+86-20-84686519
H53249-003
AZIF0079-P002C*
WNMEL00-82N01-EH
H53248-003
AZIF0080-P002C*
WNMEL00-83N01-EH
Supplier Listing
Order Number: 334785-002
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