Table Of Contents - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual

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Contents
1 Introduction ..............................................................................................................8
1.1 Objective ........................................................................................................... 8
1.2 Scope ................................................................................................................ 8
1.3 References ......................................................................................................... 9
1.4 Terminology ..................................................................................................... 10
2 Processor Mechanical Design................................................................................... 12
2.1 Processor Package Mechanical Specifications ......................................................... 12
2.2 Processor Package Description ............................................................................ 12
2.3 Package Mechanical Dimensions .......................................................................... 14
2.3.1 Package Critical-to-Function Attributes ...................................................... 15
2.3.2 Other Processor Package Specific Design Attributes..................................... 15
2.4 Processor Mass ................................................................................................. 16
2.5 Processor Material ............................................................................................. 16
2.6 Processor Markings............................................................................................ 16
2.7 Processor Mechanical Load Specification ............................................................... 17
2.8 Processor Insertion Specification ......................................................................... 17
2.9 Processor Handling Guidelines............................................................................. 17
3 Socket Mechanical Design........................................................................................ 19
3.1 LGA3647-1 Socket Overview............................................................................... 19
3.1.1 Socket Features ..................................................................................... 20
3.1.2 Socket Mechanical Requirements .............................................................. 21
3.2 Socket Critical-to-Function Interfaces................................................................... 22
3.3 Socket Components........................................................................................... 23
3.3.1 Socket Housing ...................................................................................... 23
3.3.2 Markings ............................................................................................... 25
3.3.3 Socket-Package Contact Characteristics..................................................... 26
3.3.4 Solder Ball Characteristics ....................................................................... 29
3.4 Socket Size ...................................................................................................... 30
3.5 Actuation and Insertion Requirements .................................................................. 30
3.5.1 Package Translation................................................................................ 30
3.5.2 Insertion/Removal/Actuation Forces.......................................................... 30
3.6 Orientation in Packaging, Shipping, and Handling .................................................. 31
3.7 Pick-and-Place and Dust Cover............................................................................ 31
3.7.1 Socket and Pick-and-Place Cover Durability ............................................... 31
3.8 Keep-In/Keep-Out Zone ..................................................................................... 31
4 Retention Assembly Mechanical Design ................................................................... 32
4.1 Mechanical Retention Assembly ........................................................................... 32
4.1.1 Backplate .............................................................................................. 32
4.1.2 Bolster Plate with Spring ......................................................................... 33
4.1.3 Processor Package Carrier ....................................................................... 34
4.1.4 Heatsink ............................................................................................... 36
4.2 Mechanical Load Specifications ............................................................................ 36
4.3 Heatsink Mechanical Requirements ...................................................................... 38
5 Board and System Design Guidelines ....................................................................... 39
5.1 Mechanical Design Considerations........................................................................ 39
5.1.1 Components Volumetric .......................................................................... 39
5.1.2 Components Mass .................................................................................. 39
5.1.3 Package/Socket Stack-up Height .............................................................. 40
5.2 Printed Circuit Board (PCB) Design Considerations ................................................. 40
5.2.1 Allowable Board Thickness....................................................................... 40
Order Number: 334785-002
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Intel Xeon Phi™ Processor x200 Product Family TMSDG
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