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Thermal Specifications and Design Guidelines
.
Figure 6-1.
Processor Package Thermocouple Locations, Top view
The processor and MCDRAM T
devices integrated on the MCP. This relationship is described in the following equations:
Table 6-3.
Processor T
Parameter
T
case_CPU
T
case_MCDRAM
T
LA
P
CPU
P
MCDRAM
P
FABRIC
CC
CM
CF
MC
MM
MF
Note:
1. Though the constituent device powers may vary with workload, the combined powers must add up to
be less than or equal to the Thermal Design Power (TDP).
Order Number: 334785-002
CASE
T
= T
+
CASE_CPU
LA
T
= T
+
CASE_MCDRAM
LA
Influence Parameters
CASE
Temperature on the IHS surface above the processor hot spot
Temperature on the IHS surface above the MCDRAM hot spot
Temperature of the local ambient air at the heatsink inlet
Power dissipated by the processor
Power dissipated by MCDRAMs
Power dissipated by the fabric controller (processor with fabric only)
Thermal resistance: IHS processor hot spot due to its own power
Thermal resistance: IHS processor hot spot due to MCDRAM power
Thermal resistance: IHS processor hot spot due to fabric power
Thermal resistance: IHS MCDRAM hot spot due to processor power
Thermal resistance: IHS MCDRAM hot spot due to its own power
Thermal resistance: IHS MCDRAM hot spot due to fabric power
value will be influenced by the other powered
* P
+
* P
CC
CPU
CM
MCDRAM
* P
+
* P
MC
CPU
MM
MCDRAM
Description
®
®
Intel
Xeon
Phi™ Processor x200 Product Family TMSDG
+
* P
CF
Fabric
+
* P
MF
Fabric
Reference Solution
Expected Value
Calculated
Calculated
°
< 40
C
Workload Dependent
Workload Dependent
Workload Dependent
°
0.212
C/W
°
0.134
C/W
°
0.140
C/W
°
0.147
C/W
°
0.177
C/W
°
0.196
C/W
1
1
1
45
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