Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual page 60

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Table B-1. Intel Xeon Phi Processor Platform Thermal/Mechanical Assembly Part
Information
Component
Socket-P1 3647
LGA3647-1
® ®
Intel Xeon Phi™ Processor x200 Product Family TMSDG
60
Description
Processor Socket
(Intel CAD Number J36228)
30 μ-inch Gold Contacts
Right Side P/N
Left Side P/N
15 μ-inch Gold Contacts
Right Side P/N
Left Side P/N
30 μ-inch Gold Contacts
Right Side P/N
Left Side P/N
15 μ-inch Gold Contacts
Right Side P/N
Left Side P/N
Supplier P/N Supplier Contact Info
Foxconn* Foxconn Interconnect Technologies (FIT)
Foxconn NWInG, Oregon
Eric Ling
eric.ling@fit-foxconn.com
+1-971-506-6441
Intel: J34315-001; Foxconn: PE36473-11NK3-1H
Intel: J34315-002; Foxconn: PE36473-11NK4-1H
Intel: H37600-202; Foxconn: PE36473-11NK1-1H
Intel: H37600-203; Foxconn: PE36473-11NK2-1H
Tyco* Tyco Electronics (TE) Connectivity
Ellen Liang
ellen.yh.liang@te.com
+886-2-2171-5261
Intel: J34319-001; Tyco: 2-2129710-8
Intel: J34319-002; Tyco: 2-2129710-7
Intel: J65188-001; Tyco: 2-2129710-4
Intel: J65188-002; Tyco: 2-2129710-3
Supplier Listing
Order Number: 334785-002