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Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual

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Intel
Xeon Phi™ Processor x200
Product Family
Thermal/Mechanical Specification and Design Guide (TMSDG)
June 2017
Revision 002
Order Number: 334785-002

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Summary of Contents for Intel Xeon Phi Processor x200

  • Page 1 ® Intel Xeon Phi™ Processor x200 Product Family Thermal/Mechanical Specification and Design Guide (TMSDG) June 2017 Revision 002 Order Number: 334785-002...
  • Page 2 Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at Intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses.

  • Page 3: Table Of Contents

    Components Volumetric ................39 5.1.2 Components Mass .................. 39 5.1.3 Package/Socket Stack-up Height .............. 40 Printed Circuit Board (PCB) Design Considerations ..........40 5.2.1 Allowable Board Thickness............... 40 ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...
  • Page 4 Thermal/Mechanical Solution Stress Test ..............53 A.1.1 Customer Environmental Reliability Testing ..........54 A.1.2 Socket Durability Test ................54 A.1.3 Intel Reference Component Validation ............54 Ecological Requirement..................55 Supplier Listing ......................57 Intel Enabled Supplier Information ...............57 Processor Package Mechanical Drawings ..............61 LGA3647-1 Socket-P1 Mechanical Drawings.............66 Retention Assembly Mechanical Drawings..............71...
  • Page 5 1U Heatsink, Nut Collar (Reference Only) ............... 109 E-38 1U Heatsink, Delrin* Washer (Reference Only) ............110 Processor Heatsink Module Topside Keep-Out Zone ..........112 Processor Heatsink Module Mounting Holes Keep-Out Zone........113 ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...
  • Page 6 Thermal Solution Performance Design Targets and Environment ........49 Example Thermal Stress Test: Use Condition Environment Definitions ......53 Example Mechanical Stress Test: Use Condition Environment Definitions.......54 Intel Xeon Phi Processor Platform Thermal/Mechanical Assembly Part Information..58 Processor Package Drawing List ................61 Socket Drawing List....................66 Mechanical Drawing List ..................71...
  • Page 7 - Updated contact area plating information. • Section 4.1.2 - Updated note regarding Nut Durability Spec. 334785 • Appendix B - Updated Intel and vendor P/Ns. June 2017 • Appendix E - Updated assembly mechanical drawings. • Appendix F - Updated Topside KOZ Drawing.

  • Page 8: Introduction

    Throughout this document, unless specified otherwise, the term “processor” represents any member of the Intel Xeon Phi Processor x200 Product Family; where distinction is necessary, the term “processor with fabric” will represent the Intel Xeon Phi™...

  • Page 9: References

    • Designers and suppliers of processor thermal solutions. The guidelines recommended in this document are based on experience and simulation, and preliminary work done at Intel while developing the processor. This work is ongoing and the recommendations and specifications are subject to change.

  • Page 10: Terminology

    IFP Cable Intel Fabric Passive (IFP) internal cable assembly enables high speed, low loss data connections between the Intel processor and chassis connections to an external fabric interface. Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of the package.
  • Page 11 A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, and so forth. ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 12: Processor Mechanical Design

    To ensure compatibility with the processor and the Intel Xeon Phi Processor x200 Product Family-based platform, the mechanical processor retention and thermal solution must meet the requirements and keep-out zones of both the processor and the LGA3647-1 socket.

  • Page 13: Processor Package Assembly Sketch

     Processor Mechanical Design Figure 2-1. Processor Package Assembly Sketch Figure 2-2. Processor with Fabric Package Assembly Sketch ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 14: Package Mechanical Dimensions

    The processor connects to the main board through a surface-mount-type LGA socket. A description of the socket can be found in Section 3 and socket drawings are provided in Appendix ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 15: Package Critical-To-Function Attributes

    • Package PHM alignment keying notch • Package Pin 1 Indicator (shown in Figure 2-5 Figure 2-6) Figure 2-4. Processor with Fabric Package Features and Design Attributes ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 16: Processor Mass

    Gold Plated Copper Processor Markings Refer to Table C-1 for detailed information on package surface mark and enabling mark zones. Figure 2-5. Processor Top and Bottom View ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 17: Processor Mechanical Load Specification

    IFP Cable Attachment Cycling (processor with fabric only): • Mating and unmating of the processor package and the Linear Edge Connector (LEC54A) on the Intel Fabric Passive (IFP) cable limit is 15 cycles. Processor Handling Guidelines The processor package may contain components on the top or bottom side of the package substrate.
  • Page 18 In cases where the processor is not installed into the socket, it should be placed or stored in the appropriate tray or container in order to avoid damaging the package substrate or its bottom side components. ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 19: Socket Mechanical Design

    Keying features (wall protrusions) within the contact array area and raised edges of the socket body help align the package with respect to the socket contacts. ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 20: Socket Features

    82 mm (L) x 62 mm (W) Socket Wall Interior Dimension (Package Size) 76.16 mm (L) x 56.6 mm (W) Pitch (hexagonal pattern) 0.8585 mm (X) x 0.9906 mm (Y) Ball Count 3647 ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 21: Socket Mechanical Requirements

    All dynamic requirements are under room temperature conditions while all static requirements are under 125 °C conditions. ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 22: Socket Critical-To-Function Interfaces

    • Solder Ball Co-planarity before SMT • Contact Height Above Seating Plane • Contact True Position 1. Dimensions are to be measured at pre and post SMT. ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 23: Socket Components

    • The third level is called fine alignment, which relies on the socket corner inner surfaces (datum walls) with a 0.75 mm by 1.00 mm chamfer at the guiding portion. ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 24: Socket-P1 And Bolster Plate Assembly Alignment Features

    ° in-plane rotation (also refer to Appendix C). The package sits flush on the socket contacts when aligned. Figure 3-4. Socket-P1, Mechanical Retention Assembly and PHM Alignment ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 25: Markings

    However, the seating plane standoffs should not touch the LGA lands on the bottom of the package. Intel recommends that the nominal height of interstitial seating planes be the same as the nominal height of primary seating planes, but the highest points of interstitial seating planes will be no higher than the highest points of primary socket seating planes.

  • Page 26: Socket-Package Contact Characteristics

     nickel thickness of 1.27 m [50 inches]. The paddle should have sufficient compliance to assure the solder joint reliability under the load conditions in Table 3-2. ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 27: Offset Between Lga Land Center And Solder Ball Center

    X-Y tolerances such as socket size, substrate size, and pad true positional tolerance, as defined in Appendix D. Also Intel recommends that the contact tip remains within the substrate pad before any actuation load is applied. Offset between LGA Land Center and Solder Ball Center Figure 3-6.

  • Page 28: Offset Between Lga Land Center And Solder Ball Center

    Table 3-2. The LGA contact working range is defined as the difference of contact deflection at the minimum contact load and the nominal contact deflection. ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 29: Solder Ball Characteristics

    In the event that a correlation can be identified between wetting height (also defined in Figure 3-9) and wetting angle, the wetting height may also be used as a measurable success criterion. ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 30: Socket Size

    In and Shock 0.8 lbf During shipping. Out of Plane In-Plane Removal 1.7 lbf Will meet Ergonomic requirements. PnP Cap +/- 3.5 mils placement accuracy; in-plane slack. ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 31: Orientation In Packaging, Shipping, And Handling

    These areas are illustrated in Appendix F. It is the responsibility of the socket supplier to identify any required deviation from design guidance identified here. ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 32: Retention Assembly Mechanical Design

    Retention Assembly Mechanical Design Mechanical Retention Assembly Unlike previous Intel processors that use an integrated loading mechanism or ILM, the processor is designed to work with a spring-loading mechanism to provide retention to the main board and the heatsink. Refer to...

  • Page 33: Bolster Plate With Spring

    1293 LUX)] or equivalent, and a viewing time of one visual pass of 5-7 seconds for each surface. Refer to Appendix E, “Retention Assembly Mechanical Drawings” details on the hardware. ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 34: Processor Package Carrier

    Hook-like features on the four corners of the carrier will grab onto the heatsink. The carrier design changes depending on whether the processor package does or does not integrate fabric. ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 35: Processor Package Carrier

    The keying features on the carrier ensure the processor package snaps into the carrier in only one way, and the carrier itself can be attached to the heatsink in only one orientation. ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 36: Heatsink

    4.1.4 Heatsink Intel’s heatsink solution requires a maximum volume of 83 mm x 110 mm x 27 mm. It is made of a copper base with aluminum fins. There are 50 fins in total, each 0.3 mm thick. The heatsink is integrated into the PHM which is attached to the bolster plate springs via two captive nuts (T-30 Torx bit) on either side of the heatsink.

  • Page 37: Bolster Plate Mechanical Load Specifications

    To meet the PCB primary side clearance requirement Insulator thickness 0.178 mm Tensile yield strength 758 - 930 MPa Flatness 1.0 mm Measured in unconstrained state, see drawing notes in Appendix E-4. ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 38: Heatsink Mechanical Requirements

    LGA3647 socket requires. These stiffness specifications are related to socket reliability; any potential thermal impact due to heatsink base deflection at lower stiffness levels needs to be determined separately. ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 39: Board And System Design Guidelines

    Mechanical Design Considerations The processor mechanical retention assembly design and reference thermal solution provided are appropriate for a Intel Xeon Phi Processor x200 Product Family-based platform reference board integrated into a half-width 1U air-cooled server rack enclosure. Any use of these components in a platform or configuration different from the Intel reference platform requires a complete thermal and mechanical design and validation in accordance with the customer design criteria.

  • Page 40: Package/Socket Stack-Up Height

    5.2.4 Suggested Silkscreen Marking for Socket Identification Intel is recommending that the socket name be silkscreened adjacent to the socket such that it is visible after the bolster plate is installed. ® ®...

  • Page 41: Board Deflection

    Board deflection under the LGA3647-1 socket will be kept to an acceptable level by adhering to the following conditions: 1. Following the design objectives of the Intel reference heatsink and back plate 2. Maintaining compliance to maximum static compressive load values Placement of board-to-chassis mounting holes also impacts board deflection and resultant socket solder ball stress.

  • Page 42: Thermal Specifications And Design Guidelines

    C, down to 0 C. However, the processor silicon temperatures are expected to quickly rise above 5 once operational. Contact your Intel representative if you believe your data center implementation ° warrants further consideration of minimum operational temperatures down to 0 ®...
  • Page 43 C, down to 0 C. However, the processor silicon temperatures are expected to quickly rise above 5 once operational. Contact your Intel representative if you believe your data center implementation ° warrants further consideration of minimum operational temperatures down to 0 CPU-centric workloads are those applications that are heavily compute-intensive and are able to concentrate the code and data within the processor’s on-die cache.

  • Page 44: Case Temperature Geometry And Influence Factors

    Thermal Specifications and Design Guidelines Thermal validation considerations: Due to the challenges involved with measuring real- time power on operational processors, Intel recommends using a Thermal Test Vehicle (TTV) to validate the platform thermal solution. The TTV enables precise control of the...

  • Page 45: Processor Package Thermocouple Locations, Top View

    1. Though the constituent device powers may vary with workload, the combined powers must add up to be less than or equal to the Thermal Design Power (TDP). ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 46: Measurement Locations

    T thermal CASE solutions. A couple of processor with fabric examples are provided to illustrate these relationships, with values representing the Intel reference thermal solution: Example 1: Processor T based on a hypothetical processor centric type workload. CASE + ...

  • Page 47: Socket Maximum Temperature

    The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance. To ensure socket long term reliability, Intel defines socket maximum temperature using a via on the underside of the main board. Exceeding the...

  • Page 48: Storage Conditions Specifications

    Applying thermal interface material between the processor IHS and the heatsink base will improve the heat transfer between the IHS and the heatsink. Honeywell* PCM45F material is selected for use with the Intel reference heatsink design. The recommended size ensures adequate coverage at the interface between the processor IHS and heatsink pedestal.

  • Page 49: Reference Thermal Solution Performance Targets

    De-rate at higher altitudes. Airflow 9.44 (20) l/s (CFM) Airflow through the heatsink fins Note: Thermal boundary conditions are applied in establishing the processor heatsink cooling solution. ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 50: Thermal Solution Performance Characterization

    Power only the fabric, no power to the CPU or MCDRAMs:  = (T – T ) / P case_CPU Fabric  = (T – T ) / P case_MCDRAM Fabric ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 51: Thermal Test Vehicle (Ttv) Correction Factors

    TTV to Product Correction Factors MCDRAM 0.0006 C/W -0.004 C/W Processor correction factors are subject to change over time. Contact your Intel Xeon Phi thermal representative if you have questions. 6.2.4 Thermal Management Guidelines Processor thermal solution, heatsink and/or cold-plate, design must comply with T CASE targets.
  • Page 52 Regardless of which scheme is employed, system designers must ensure the T specification is met under all operational conditions. CASE 6.2.4.3 Tcontrol Relief Intel may choose to provide T relief near product launch, T values closer CONTROL CONTROL to 0, as compared to the factory configured T values.

  • Page 53: A Quality And Reliability Requirements

    Quality and Reliability Requirements Thermal/Mechanical Solution Stress Test Intel evaluates reliability performance based on the use conditions (operating environment) of the end product by using acceleration models. The use condition environment definitions provided in the tables below are based on speculative use condition assumptions, and are provided as examples only.

  • Page 54: Customer Environmental Reliability Testing

    A.1.3 Intel Reference Component Validation Intel tests reference components individually and as an assembly on mechanical test boards and assesses performance to the envelopes specified in previous sections by varying boundary conditions.

  • Page 55: Ecological Requirement

    Halogen flame retardant free (HFR-Free) PCB: Current guidance for the socket pad layout supports FR4 and HFR-Free designs. In future revisions of this document, Intel may provide guidance on the mechanical impact to using a HFR-free laminate in the PCB. This will be limited to workstations.
  • Page 56 (PHM) including the Thermal Interface Material (TIM) and the processor mechanical retention assembly be RoHS compliant, by using 100% lead-free technology. RoHS reference source is http://ec.europa.eu/environment/waste/rohs_eee/ events_rohs3_en.htm. ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 57: B Supplier Listing

    This chapter contains supplier details including contact information for the socket, heatsink, TIM and other retention components in future revisions. • Supplier content is provided by Intel as a convenience to its customers. Intel does not make any representations or warranties whatsoever regarding the quality, reliability, functionality, or compatibility of these devices.

  • Page 58: Intel Xeon Phi Processor Platform Thermal/Mechanical Assembly Part Information

     Supplier Listing Table B-1. Intel Xeon Phi Processor Platform Thermal/Mechanical Assembly Part Information Component Description Supplier P/N Supplier Contact Info Heatsink 1U Heatsink Assembly; Cu - Delta* DELTA ELECTRONICS, INC. Al Reference Heatsink, washers, nuts and collars. Stephanie Liu...
  • Page 59  Supplier Listing Table B-1. Intel Xeon Phi Processor Platform Thermal/Mechanical Assembly Part Information Component Description Supplier P/N Supplier Contact Info Bolster Plate Bolster plate, posts, leaf Assembly spring assembly and insulator. Intel P/N H77470-008 Lotes P/N AZIF0085-P002C* Foxconn P/N...
  • Page 60  Supplier Listing Table B-1. Intel Xeon Phi Processor Platform Thermal/Mechanical Assembly Part Information Component Description Supplier P/N Supplier Contact Info Socket-P1 3647 Processor Socket Foxconn* Foxconn Interconnect Technologies (FIT) Foxconn NWInG, Oregon LGA3647-1 (Intel CAD Number J36228) Eric Ling eric.ling@fit-foxconn.com...

  • Page 61: C Processor Package Mechanical Drawings

    Processor PMD (Sheet 2 of 2) Figure C-2 Processor with Fabric PMD (Sheet 1 of 2) Figure C-3 Processor with Fabric PMD (Sheet 2 of 2) Figure C-4 ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 62: Processor Pmd (Sheet 1 Of 2)

     Processor Package Mechanical Drawings Figure C-1. Processor PMD (Sheet 1 of 2)  ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 63: Processor Pmd (Sheet 2 Of 2)

     Processor Package Mechanical Drawings Figure C-2. Processor PMD (Sheet 2 of 2) ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 64: Processor With Fabric Pmd (Sheet 1 Of 2)

     Processor Package Mechanical Drawings Figure C-3. Processor with Fabric PMD (Sheet 1 of 2) ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 65: Processor With Fabric Pmd (Sheet 2 Of 2)

     Processor Package Mechanical Drawings Figure C-4. Processor with Fabric PMD (Sheet 2 of 2) ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 66: Lga3647-1 Socket-P1 Mechanical Drawings

    Socket Mechanical Drawing (Sheet 2 of 4) Figure D-2 Socket Mechanical Drawing (Sheet 3 of 4) Figure D-3 Socket Mechanical Drawing (Sheet 4 of 4) Figure D-4 ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 67: Socket Mechanical Drawing (Sheet 1 Of 4)

     LGA3647-1 Socket-P1 Mechanical Drawings Figure D-1. Socket Mechanical Drawing (Sheet 1 of 4)  ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 68: Socket Mechanical Drawing (Sheet 2 Of 4)

     LGA3647-1 Socket-P1 Mechanical Drawings Figure D-2. Socket Mechanical Drawing (Sheet 2 of 4) ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 69: Socket Mechanical Drawing (Sheet 3 Of 4)

     LGA3647-1 Socket-P1 Mechanical Drawings Figure D-3. Socket Mechanical Drawing (Sheet 3 of 4) ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 70: Socket Mechanical Drawing (Sheet 4 Of 4)

     LGA3647-1 Socket-P1 Mechanical Drawings Figure D-4. Socket Mechanical Drawing (Sheet 4 of 4) ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 71: Retention Assembly Mechanical Drawings

    1U Heatsink Assembly, 2/2 (Reference Only) Figure E-30 1U Heatsink, 1/2 (Reference Only) Figure E-31 1U Heatsink, 2/2 (Reference Only) Figure E-32 1U Heatsink, Label (Reference Only) Figure E-33 ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 72: Heatsink, Pcm45F Tim (Reference Only)

    Figure E-35 1U Heatsink, Nut, M4, 2/2 (Reference Only) Figure E-36 1U Heatsink, Nut Collar (Reference Only) Figure E-37 1U Heatsink, Delrin* Washer (Reference Only) Figure E-38 ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...
  • Page 73  Retention Assembly Mechanical Drawings Figure E-1. Backplate Assembly, 1/3 ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...
  • Page 74  Retention Assembly Mechanical Drawings Figure E-2. Backplate Assembly, 2/3 ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...
  • Page 75  Retention Assembly Mechanical Drawings Figure E-3. Backplate Assembly, 3/3 ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 76: Bolster Plate Assembly And Dust Cover

     Retention Assembly Mechanical Drawings Figure E-4. Bolster Plate Assembly and Dust Cover ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...
  • Page 77  Retention Assembly Mechanical Drawings Figure E-5. Bolster Plate Assembly, 1/2 ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...
  • Page 78  Retention Assembly Mechanical Drawings Figure E-6. Bolster Plate Assembly, 2/2 ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...
  • Page 79  Retention Assembly Mechanical Drawings Figure E-7. Heatsink Module Clip (non-Fabric), 1/2 ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...
  • Page 80  Retention Assembly Mechanical Drawings Figure E-8. Heatsink Module Clip (non-Fabric), 2/2 ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...
  • Page 81  Retention Assembly Mechanical Drawings Figure E-9. Heatsink Module Clip (Fabric), 1/2 ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...
  • Page 82  Retention Assembly Mechanical Drawings Figure E-10. Heatsink Module Clip (Fabric), 2/2 ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...
  • Page 83  Retention Assembly Mechanical Drawings Figure E-11. Backplate ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 84: Backplate Insulator

     Retention Assembly Mechanical Drawings Figure E-12. Backplate Insulator ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 85: Back Plate, M3 Stud

     Retention Assembly Mechanical Drawings Figure E-13. Back Plate, M3 Stud ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...
  • Page 86  Retention Assembly Mechanical Drawings Figure E-14. Bolster Plate, 1/2 ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...
  • Page 87  Retention Assembly Mechanical Drawings Figure E-15. Bolster Plate, 2/2 ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 88: Bolster Plate, Insulator

     Retention Assembly Mechanical Drawings Figure E-16. Bolster Plate, Insulator ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 89: Bolster Plate, Small Guide Post

     Retention Assembly Mechanical Drawings Figure E-17. Bolster Plate, Small Guide Post ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 90: Bolster Plate, Large Guide Post

     Retention Assembly Mechanical Drawings Figure E-18. Bolster Plate, Large Guide Post ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 91: Bolster Plate, Lec Guide Pin

     Retention Assembly Mechanical Drawings Figure E-19. Bolster Plate, LEC Guide Pin ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 92: Bolster Plate, Corner Standoff

     Retention Assembly Mechanical Drawings Figure E-20. Bolster Plate, Corner Standoff ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 93: Bolster Plate, Spring Assembly

     Retention Assembly Mechanical Drawings Figure E-21. Bolster Plate, Spring Assembly ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 94: Bolster Plate, Spring

     Retention Assembly Mechanical Drawings Figure E-22. Bolster Plate, Spring ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 95: Bolster Plate, Spring Stud, M4

     Retention Assembly Mechanical Drawings Figure E-23. Bolster Plate, Spring Stud, M4 ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 96: Bolster Plate, Spring Rivet

     Retention Assembly Mechanical Drawings Figure E-24. Bolster Plate, Spring Rivet ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 97: Bolster Plate, M3 Captive Nut

     Retention Assembly Mechanical Drawings Figure E-25. Bolster Plate, M3 Captive Nut ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 98: Bolster Plate, M3 Captive Nut Collar

     Retention Assembly Mechanical Drawings Figure E-26. Bolster Plate, M3 Captive Nut Collar ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...
  • Page 99  Retention Assembly Mechanical Drawings Figure E-27. Socket-P, Dust Cover, 1/2 ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...
  • Page 100  Retention Assembly Mechanical Drawings Figure E-28. Socket-P, Dust Cover, 2/2 ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...
  • Page 101  Retention Assembly Mechanical Drawings Figure E-29. 1U Heatsink Assembly, 1/2 (Reference Only) ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...
  • Page 102  Retention Assembly Mechanical Drawings Figure E-30. 1U Heatsink Assembly, 2/2 (Reference Only) ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...
  • Page 103  Retention Assembly Mechanical Drawings Figure E-31. 1U Heatsink, 1/2 (Reference Only) ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...
  • Page 104  Retention Assembly Mechanical Drawings Figure E-32. 1U Heatsink, 2/2 (Reference Only) ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...
  • Page 105  Retention Assembly Mechanical Drawings Figure E-33. 1U Heatsink, Label (Reference Only) ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...
  • Page 106  Retention Assembly Mechanical Drawings Figure E-34. 1U Heatsink, PCM45F TIM (Reference Only) ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...
  • Page 107  Retention Assembly Mechanical Drawings Figure E-35. 1U Heatsink, Nut, M4, 1/2 (Reference Only) ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...
  • Page 108  Retention Assembly Mechanical Drawings Figure E-36. 1U Heatsink, Nut, M4, 2/2 (Reference Only) ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...
  • Page 109  Retention Assembly Mechanical Drawings Figure E-37. 1U Heatsink, Nut Collar (Reference Only) ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...
  • Page 110  Retention Assembly Mechanical Drawings Figure E-38. 1U Heatsink, Delrin* Washer (Reference Only) DWG. NO SHT. H37265 ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 111: F Mechanical Kozs

    Description Figure Processor Heatsink Module Topside Keep-Out Zone Figure F-1 Processor Heatsink Module Mounting Holes Keep-Out Zone Figure F-2 Processor Heatsink Module Backplate Keep-Out Zone Figure F-3 ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 112: Processor Heatsink Module Topside Keep-Out Zone

     Mechanical KOZs Figure F-1. Processor Heatsink Module Topside Keep-Out Zone ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

  • Page 113: Processor Heatsink Module Mounting Holes Keep-Out Zone

     Mechanical KOZs Figure F-2. Processor Heatsink Module Mounting Holes Keep-Out Zone ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor x200 Product Family TMSDG...

  • Page 114: Processor Heatsink Module Backplate Keep-Out Zone

     Mechanical KOZs Figure F-3. Processor Heatsink Module Backplate Keep-Out Zone ® ® Intel Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002...

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