Socket-P1 And Bolster Plate Assembly Alignment Features; Socket-P1, Mechanical Retention Assembly And Phm Alignment - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual

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Figure 3-3.

Socket-P1 and Bolster Plate Assembly Alignment Features

The socket also has two orientation posts or protrusions (keys) placed on opposite
sides of the socket as noted in
notches at the corresponding locations. When package keying notches align with socket
orientation posts, it prevents the package from being mistakenly installed with a 180
in-plane rotation (also refer to
contacts when aligned.
Figure 3-4.

Socket-P1, Mechanical Retention Assembly and PHM Alignment

® ®
Intel Xeon Phi™ Processor x200 Product Family TMSDG
24
Bolster Plate
Small Coarse (Gross)
Alignment Post
Appendix
Appendix
Socket Wall
Alignment Features
Socket-P1 Key
Pin A1
D. The package substrate will have keying
C). The package sits flush on the socket
Socket Mechanical Design
Bolster Plate
Heatsink Leveling Stud
Bolster Plate
Large Coarse (Gross)
Alignment Post
Order Number: 334785-002
°