Thermal Solution Performance Characteristics - Intel 5100 Series Instruction Manual

Thermal/Mechanical Reference Design
If this solution is intended to be used on baseboards that fall outside of this range, then
some aspects of the design, including but not limited to the CEK spring design and the
standoff heights, may need to change. Therefore, system designers need to evaluate
the thermal performance and mechanical behavior of the CEK design on baseboards
with different thicknesses.
Refer to
standoffs are standard components that are made captive to the heatsink for ease of
handling and assembly.
Contact your Intel field sales representative for an electronic version of mechanical and
thermal models of the CEK (Pro/Engineer*, IGES and Icepak*, Flotherm* formats).
Pro/Engineer*, Icepak* and Flotherm* models are available on Intel Business Link
(IBL).
Note: Intel reserves the right to make changes and modifications to the design as necessary.
Note: The thermal mechanical reference design for the Dual-Core Intel Xeon Processor 5100
Series was verified according to the Intel validation criteria given in
Any thermal mechanical design using some of the reference components in
combination with any other thermal mechanical solution needs to be fully validated
according to the customer criteria. Also, if customer thermal mechanical validation
criteria differ from the Intel criteria, the reference solution should be validated against
the customer criteria.
2.4.4.3 Structural Considerations of CEK
As Intel explores methods of keeping thermal solutions within the air-cooling space, the
mass of the thermal solutions is increasing. Due to the flexible nature (and associated
large deformation) of baseboard-only attachments, Intel reference solutions, such as
CEK, are now commonly using direct chassis attach (DCA) as the mechanical retention
design. The mass of the new thermal solutions is large enough to require consideration
for structural support and stiffening on the chassis. Intel has published a best know
method (BKM) document that provides specific structural guidance for designing DCA
thermal solutions. The document is titled Chassis Strength and Stiffness Measurement
and Improvement Guidelines for Direct Chassis Attach Solutions.
2.4.5

Thermal Solution Performance Characteristics

Figure 2-15
heatsinks, respectively. These figures show the thermal performance and the pressure
drop through fins of the heatsink versus the airflow provided. The best-fit equations for
these curves are also provided to make it easier for users to determine the desired
value without any error associated with reading the graph.
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
Appendix A for drawings of the heatsinks and CEK spring. The screws and
and Figure 2-16 show the performance of the 2U+ and 1U passive
Appendix D.1.
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