Processor Package Carrier; Bolster Plate And Spring - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual

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Figure 4-2.

Bolster Plate and Spring

4.1.3

Processor Package Carrier

The carrier is an integral part of the Processor Heatsink Module (PHM). The processor
package is inserted into the carrier, then the Thermal Interface Material (TIM) and
heatsink are attached. The carrier design will grab onto the package, and keying
features will match cutouts on package. Hook-like features on the four corners of the
carrier will grab onto the heatsink. The carrier design changes depending on whether
the processor package does or does not integrate fabric.
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Intel Xeon Phi™ Processor x200 Product Family TMSDG
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Bolster Plate
Assembly
Pin A1 Mark
Bolster Plate
Assembly
Retention Assembly Mechanical Design
Heatsink
Small Coarse
Alignment Post
Leaf Spring
Assembly
Heatsink
Large Coarse
Alignment Post
Spring
Assembly
Bolster Plate
Order Number: 334785-002