Socket Mechanical Requirements; Hexagonal Array In Lga3647 Socket Bga Ball Footprint - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual

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Socket Mechanical Design
Figure 3-2.

Hexagonal Array in LGA3647 Socket BGA Ball Footprint

The socket cover is intended to be reusable and recyclable. It enables socket pick-and-
place during main board assembly. the socket cover also protects the socket contacts
from contamination and damage during board assembly and handling.
Features of the socket include:
• Contact housing
• Processor package keying
• Package seating plane
• Side walls for package alignment
• Center cavity for the processor secondary side and main board primary side
components
3.1.2

Socket Mechanical Requirements

3.1.2.1 Attachment
The socket is designed for Surface Mounted Technology (SMT) assembly onto the main
board. The board assembly process and sequence may be different from one design to
another and may require multiple assembly steps. The socket will be attached to the
main board solely via its 3647 solder balls. There are no additional external methods
(screws, extra solder, adhesive, etc.) to attach the socket.
The socket is tested against mechanical shock and vibration requirements such as
those listed in
components under the loading conditions outlined in
dynamic loading should not exceed these levels.
3.1.2.2 Socket Loading and Deflection Specifications
Table 3-2
socket. These mechanical load limits should not be exceeded during component
assembly, mechanical stress testing, or standard drop and shipping conditions. All
dynamic requirements are under room temperature conditions while all static
requirements are under 125 °C conditions.
Order Number: 334785-002
33.8
mil
Appendix A under the expected use conditions with all assembly
provides loading and board deflection specifications for the LGA3647-1
39
mil
Section 3.1.2.2. Customer
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Intel Xeon Phi™ Processor x200 Product Family TMSDG
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