Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual page 5

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4-2
Bolster Plate and Spring ........................................................................................ 34
4-3
Processor Package Carrier...................................................................................... 35
4-4
Processor with Fabric Package Carrier...................................................................... 35
4-5
Processor Mechanical Assembly .............................................................................. 36
6-1
Processor Package Thermocouple Locations, Top view ............................................... 45
6-2
Processor with Fabric T
6-3
6-4
Reference Heatsink Pressure Drop Curve ................................................................. 50
C-1
Processor PMD (Sheet 1 of 2) ................................................................................. 62
C-2
Processor PMD (Sheet 2 of 2) ................................................................................. 63
C-3
Processor with Fabric PMD (Sheet 1 of 2) ................................................................. 64
C-4
Processor with Fabric PMD (Sheet 2 of 2) ................................................................. 65
D-1
Socket Mechanical Drawing (Sheet 1 of 4)................................................................ 67
D-2
Socket Mechanical Drawing (Sheet 2 of 4)................................................................ 68
D-3
Socket Mechanical Drawing (Sheet 3 of 4)................................................................ 69
D-4
Socket Mechanical Drawing (Sheet 4 of 4)................................................................ 70
E-1
Backplate Assembly, 1/3........................................................................................ 73
E-2
Backplate Assembly, 2/3........................................................................................ 74
E-3
Backplate Assembly, 3/3........................................................................................ 75
E-4
Bolster Plate Assembly and Dust Cover .................................................................... 76
E-5
Bolster Plate Assembly, 1/2.................................................................................... 77
E-6
Bolster Plate Assembly, 2/2.................................................................................... 78
E-7
Heatsink Module Clip (non-Fabric), 1/2 .................................................................... 79
E-8
Heatsink Module Clip (non-Fabric), 2/2 .................................................................... 80
E-9
Heatsink Module Clip (Fabric), 1/2 .......................................................................... 81
E-10
Heatsink Module Clip (Fabric), 2/2 .......................................................................... 82
E-11
Backplate ............................................................................................................ 83
E-12
Backplate Insulator ............................................................................................... 84
E-13
Back Plate, M3 Stud .............................................................................................. 85
E-14
Bolster Plate, 1/2.................................................................................................. 86
E-15
Bolster Plate, 2/2.................................................................................................. 87
E-16
Bolster Plate, Insulator .......................................................................................... 88
E-17
Bolster Plate, Small Guide Post ............................................................................... 89
E-18
Bolster Plate, Large Guide Post ............................................................................... 90
E-19
Bolster Plate, LEC Guide Pin ................................................................................... 91
E-20
Bolster Plate, Corner Standoff ................................................................................ 92
E-21
Bolster Plate, Spring Assembly ............................................................................... 93
E-22
Bolster Plate, Spring ............................................................................................. 94
E-23
Bolster Plate, Spring Stud, M4 ................................................................................ 95
E-24
Bolster Plate, Spring Rivet ..................................................................................... 96
E-25
Bolster Plate, M3 Captive Nut ................................................................................. 97
E-26
Bolster Plate, M3 Captive Nut Collar ........................................................................ 98
E-27
Socket-P, Dust Cover, 1/2 ..................................................................................... 99
E-28
Socket-P, Dust Cover, 2/2 ................................................................................... 100
E-29
1U Heatsink Assembly, 1/2 (Reference Only).......................................................... 101
E-30
1U Heatsink Assembly, 2/2 (Reference Only).......................................................... 102
E-31
1U Heatsink, 1/2 (Reference Only) ........................................................................ 103
E-32
1U Heatsink, 2/2 (Reference Only) ........................................................................ 104
E-33
1U Heatsink, Label (Reference Only) ..................................................................... 105
E-34
1U Heatsink, PCM45F TIM (Reference Only)............................................................ 106
E-35
1U Heatsink, Nut, M4, 1/2 (Reference Only) ........................................................... 107
E-36
1U Heatsink, Nut, M4, 2/2 (Reference Only) ........................................................... 108
E-37
1U Heatsink, Nut Collar (Reference Only) ............................................................... 109
E-38
1U Heatsink, Delrin* Washer (Reference Only) ....................................................... 110
F-1
Processor Heatsink Module Topside Keep-Out Zone ................................................. 112
F-2
Processor Heatsink Module Mounting Holes Keep-Out Zone....................................... 113
Order Number: 334785-002
Measurement Locations. ................................................. 46
®
Intel
Xeon Phi™ Processor x200 Product Family TMSDG
5

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