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Manuals and User Guides for Intel Celeron D. We have
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Intel Celeron D manual available for free PDF download: Thermal Design Manual
Intel Celeron D Thermal Design Manual (64 pages)
775-Land LGA Package for Embedded Applications
Brand:
Intel
| Category:
Computer Hardware
| Size: 1.08 MB
Table of Contents
Table of Contents
3
Introduction
6
Document Goals and Scope
6
Importance of Thermal Management
6
Document Goals
6
Document Scope
6
References
7
Terms and Definitions
7
Reference Documents
7
Processor Thermal/Mechanical Information
9
Mechanical Requirements
9
Processor Package
9
Package IHS Load Areas
9
Heatsink Attach
10
General Guidelines
10
Additional Guidelines
11
Heatsink Clip Load Requirement
11
Thermal Requirements
11
Processor Case Temperature and Power Dissipation
12
Thermal Profile
12
Processor Case Temperature Measurement Location
12
Control
13
Example Thermal Profile
13
Heatsink Design Considerations
14
Heatsink Size
15
Heatsink Mass
15
Package IHS Flatness
15
Thermal Interface Material
16
Summary
16
System Thermal Solution Considerations
16
Improving Chassis Thermal Performance
16
Thermal Metrology
18
Characterizing Cooling Performance Requirements
18
Example
19
Processor Thermal Characterization Parameter Relationships
19
Processor Thermal Solution Performance Assessment
20
Local Ambient Temperature Measurement Guidelines
20
Measuring Active Heatsinks
20
Measuring Passive Heatsinks
21
Measuring TLA - Active Heatsink
21
Processor Case Temperature Measurement Guidelines
22
Measuring TLA - Passive Heatsink
22
Thermal Management Logic and Thermal Monitor
23
Processor Power Dissipation
23
Thermal Monitor Implementation
23
PROCHOT# Signal
23
Thermal Control Circuit
24
Concept for Clocks under Thermal Monitor Control
24
Operation and Configuration
25
On-Demand Mode
25
System Considerations
26
Operating System and Application Software Considerations
26
On-Die Thermal Diode
26
Correction Factors for the On-Die Thermal Diode
27
Reading the On-Die Thermal Diode Interface
27
Thermal Diode Interface
27
THERMTRIP# Signal
28
Cooling System Failure Warning
28
Acoustic Fan Speed Control
29
How On-Die Thermal Diode, TCONTROL and Thermal Profile Work Together
29
On-Die Thermal Diode Greater than TCONTROL
29
On-Die Thermal Diode Less than TCONTROL
29
Intel Enabled Thermal Solutions
30
Thermal Solution Requirements
30
ATX Form Factor
31
Form Factor
31
Thermal Characterization Parameters for Various Operating Conditions
31
Enabled Thermal Solutions
31
Copper Heatsink
32
Form Factor
33
Thermal Solution Z-Height Constraints
33
Copper Heatsink
33
Case-To-Ambient Thermal Characterization Parameter Ψ
34
Ca (°C/W)
34
Reference Thermal Mechanical Solution
35
Height Restrictions
35
Conclusion
36
LGA775 Socket Heatsink Loading
37
Board Deflection Definition
38
Board Deflection Configuration Definitions
38
Example: Defining Heatsink Preload Meeting Board Deflection Limit
40
Heatsink Clip Load Metrology
42
Load Cell Installation in Machined Heatsink Base Pocket - Bottom View
43
Load Cell Installation in Machined Heatsink Base Pocket - Side View
43
Preload Test Configuration
44
Typical Test Equipment
44
Thermal Interface Management
46
Case Temperature Reference Methodology
47
Definitions
47
Supporting Test Equipment
47
Thermocouple Bead Placement (View 1)
52
Thermocouple Bead Placement (View 2)
52
Board Level PWM and Fan Speed Control Requirements
57
Mechanical Drawings
58
Atx/Μatx Motherboard Keep-Out Footprint Definition and Height Restrictions
58
Atx/Μatx Motherboard Keep-Out Footprint Definition and Height Restrictions for Enabling Components, Sheet 2
58
2U Motherboard Component Keep-In Definition, Primary Side
58
2U Motherboard Component Keep-In Definition, Secondary Side
58
Atx/Μatx Motherboard Keep-Out Footprint Definition and Height Restrictions
59
Vendor Information
64
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