Use Conditions Environment - Intel 5400 Series Design Manuallines

Table E-1.

Use Conditions Environment

Use Environment
Shipping and
Handling
Shipping and
Handling
Note: In the case of a discrepancy, information in the most recent LGA771 Socket Mechanical Design
Guidelines supersedes that in the Table E-1 above.
E.1.2.2 Recommended Test Sequence
Each test sequence should start with components (i.e. baseboard, heatsink assembly,
etc.) that have not been previously submitted to any reliability testing.
The test sequence should always start with a visual inspection after assembly, and
BIOS/Processor/memory test. The stress test should be then followed by a visual
inspection and then BIOS/Processor/memory test.
E.1.2.3 Post-Test Pass Criteria
The post-test pass criteria are:
1. No significant physical damage to the heatsink and retention hardware.
2. Heatsink remains seated and its bottom remains mated flatly against the IHS
surface. No visible gap between the heatsink base and processor IHS. No visible tilt
of the heatsink with respect to the retention hardware.
92
Speculative Stress
Condition
Mechanical Shock
• System-level
• Unpackaged
• Trapezoidal
• 25 g
• velocity change is based
on packaged weight
Product Non-
Weight (lbs) palletized
Product
Velocity
†
Change (in/
sec)
< 20 lbs 250
20 to > 40 225
40 to > 80 205
80 to < 100 175
100 to < 145
120
125
≥120
†
Change in velocity is based
upon a 0.5 coefficient of
restitution.
Random Vibration
• System Level
• Unpackaged
• 5 Hz to 500 Hz
• 2.20 g RMS random
2
• 5 Hz @ .001 g /Hz to
2
20 Hz @ 0.01 g /Hz
(slope up)
• 20 Hz to 500 Hz @ 0.01
2
g /Hz (flat)
• Random control limit
tolerance is ± 3 dB
Quality and Reliability Requirements
Example Use Example 7-Yr
Condition Stress Equiv.
Total of 12 n/a
drops per
system:
• 2 drops per
axis
• ± direction
Total per n/a
system:
• 10 minutes
per axis
• 3 axes
Quad-Core Intel® Xeon® Processor 5400 Series TMDG
Example 10-
Yr Stress
Equiv.
n/a
n/a