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Mechanical Drawings
B
Mechanical Drawings
The mechanical drawings included in this appendix refer to the thermal mechanical
enabling components for the Quad-Core Intel® Xeon® Processor 5400 Series.
Note:
Intel reserves the right to make changes and modifications to the design as necessary.
Table B-1.
Mechanical Drawing List
"2U CEK Heatsink (Sheet 1 of 4)"
"2U CEK Heatsink (Sheet 2 of 4)"
"2U CEK Heatsink (Sheet 3 of 4)"
"2U CEK Heatsink (Sheet 4 of 4)"
"CEK Spring (Sheet 1 of 3)"
"CEK Spring (Sheet 2 of 3)"
"CEK Spring (Sheet 3 of 3)"
"Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components
(Sheet 1 of 6)"
"Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components
(Sheet 2 of 6)"
"Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components
(Sheet 3 of 6)"
"Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components
(Sheet 4 of 6)"
"Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components
(Sheet 5 of 6)"
"Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components
(Sheet 6 of 6)"
"1U CEK Heatsink (Sheet 1 of 4)"
"1U CEK Heatsink (Sheet 2 of 4)"
"1U CEK Heatsink (Sheet 3 of 4)"
"1U CEK Heatsink (Sheet 4 of 4)"
"Active CEK Thermal Solution Volumetric (Sheet 1 of 3)"
"Active CEK Thermal Solution Volumetric (Sheet 2 of 3)"
"Active CEK Thermal Solution Volumetric (Sheet 3 of 3)"
"1U Alternative Heatsink (1 of 4)"
"1U Alternative Heatsink (2 of 4)"
"1U Alternative Heatsink (3 of 4)"
"1U Alternative Heatsink (4 of 4)"
Quad-Core Intel® Xeon® Processor 5400 Series TMDG
Drawing Description
Figure Number
Figure B-1
Figure B-2
Figure B-3
Figure B-4
Figure B-5
Figure B-6
Figure B-7
Figure B-8
Figure B-9
Figure B-10
Figure B-11
Figure B-12
Figure B-13
Figure B-14
Figure B-15
Figure B-16
Figure B-17
Figure B-18
Figure B-19
Figure B-20
Figure B-21
Figure B-22
Figure B-23
Figure B-24
57
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