Processor Thermal/Mechanical Information; Mechanical Requirements; Processor Package; Figure 1. Package Ihs Load Areas - Intel EM64T - Celeron D 336 Boxed Ena User Manual

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2 Processor Thermal/Mechanical
Information
2.1

Mechanical Requirements

2.1.1

Processor Package

The Pentium 4 processor is packaged in a 775–land LGA package that interfaces with the
motherboard via a LGA775 socket. Refer to the processor datasheet for detailed mechanical
specifications.
The processor connects to the motherboard through a land grid array (LGA) surface mount
socket. The socket contains 775 contacts arrayed about a cavity in the center of the socket with
solder balls for surface mounting to the motherboard. The socket is named LGA775 socket. A
description of the socket can be found in the LGA775 Socket Mechanical Design Guide.
The package includes an integrated heat spreader (IHS) that is shown in Figure 1 for illustration
only. Refer to the processor datasheet for further information. In case of conflict, the package
dimensions in the processor datasheet supersedes dimensions provided in this document.

Figure 1. Package IHS Load Areas

S u bs tra te S u bs tra te
Thermal/Mechanical Design Guide

Processor Thermal/Mechanical Information

To p S u rfa c e o f IHS To p S u rfa c e o f IHS
to in s ta ll a h e a ts in k to in s ta ll a h e a ts in k
IH S S te p IH S S te p
to in te rfa c e w i th LGA775 to in te rfa c e w i th LGA775
S o c k e t Lo a d P la te S o c k e t Lo a d P la te
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