Processor Thermal/Mechanical Information; Mechanical Requirements; Processor Package; Figure 2-1. Package Ihs Load Areas - Intel BX80570E8200 - Core 2 Duo 2.66 GHz Processor Design Manual

Processor Thermal/Mechanical Information

2 Processor Thermal/Mechanical
Information
2.1

Mechanical Requirements

2.1.1

Processor Package

The processors covered in the document are packaged in a 775-Land LGA package
that interfaces with the motherboard using a LGA775 socket. Refer to the datasheet
for detailed mechanical specifications.
The processor connects to the motherboard through a land grid array (LGA) surface
mount socket. The socket contains 775 contacts arrayed about a cavity in the center
of the socket with solder balls for surface mounting to the motherboard. The socket is
named LGA775 socket. A description of the socket can be found in the LGA775 Socket
Mechanical Design Guide.
The package includes an integrated heat spreader (IHS) that is shown in Figure 2-1
for illustration only. Refer to the processor datasheet for further information. In case
of conflict, the package dimensions in the processor datasheet supersedes dimensions
provided in this document.

Figure 2-1. Package IHS Load Areas

S u bs tra te S u bs tra te
Thermal and Mechanical Design Guidelines
To p S u rfa c e o f IHS To p S u rfa c e o f IHS
to in s ta ll a h e a ts in k to in s ta ll a h e a ts in k
IH S S te p IH S S te p
to in te rfa c e w i th LGA775 to in te rfa c e w i th LGA775
S o c k e t Lo a d P la te S o c k e t Lo a d P la te
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