Intel SC5300BRP Technical Product Specification page 4

Intel® Server Chassis SC5300 5U Kit TPS
3.1.8 Mean Time Between Failures (MTBF) ....................................................... 32
3.2 730-W Power Supply ................................................................................. 32
3.2.1 730W Power Supply Mechanical Outline ................................................... 33
3.2.2 Output Wire Harness ................................................................................ 34
3.2.3 Airflow Requirements and Temperature Rise ............................................ 34
3.2.4 AC Specifications....................................................................................... 34
3.2.5 730-W DC Specifications .......................................................................... 35
3.2.6 730-W Protection Circuits .......................................................................... 37
3.2.7 730-W Power Supply Control and Indicator Functions............................... 38
3.2.8 730-W Mean Time Between Failure (MTBF).............................................. 38
3.2.9 Redundant (1+1) Hot Swap Mode.............................................................. 38
3.3 730-W Power Distribution Board................................................................ 38
3.3.1 Power Distribution Mechanical Overview ................................................... 39
3.3.2 Temperature Operational Limits................................................................ 41
3.3.3 Electrical Specification ............................................................................... 41
3.3.4 Protection Circuits...................................................................................... 46
3.3.5 Control and Indicator Functions ................................................................. 46
3.4 SMBus Monitoring Interface....................................................................... 47
3.4.1 Mean Time Between Failures (MTBF) ....................................................... 48
4. System Cooling ..................................................................................................... 49
4.1 Fan Configuration ...................................................................................... 49
4.1.1 Processor Passive Heat Sink Cooling Solution.......................................... 49
4.1.2 Base Cooling Solution................................................................................ 50
4.1.2 Redundant Cooling Solution ...................................................................... 50
4.2 Fan Control ................................................................................................ 52
Revision 1.31
Introduction
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