Installation Guide
Note
The ambient temperature and humidity of the device are measured 1.5 m (59.06 in.) above the floor and 0.4 m
(15.75 in.) before the switch rack when there is no protective plate in front or at the back of the rack.
2.2.5
Cleanliness Requirements
Dust poses a major threat to the running of the device. The buildup of dust on the device can result in static
electricity, causing poor contact between the metallic joints. Dust buildup is more likely to occur in environments
with low relative humidity, which not only impacts the service life of the device but also increases the likelihood
of communication failure. The following table shows the specifications for dust concentration and particle size in
the equipment room.
Table 2-1
Requirements for Dust
Particle Size
≥ 0.5 µm
≥ 5 µm
Apart from dust, the salt, acid, and sulfide in the air of the machine room must also meet strict requirements.
These harmful substances will accelerate metal corrosion and component aging. Therefore, the machine room
should be properly protected against the intrusion of harmful gases, such as sulfur dioxide, hydrogen sulfide,
nitrogen dioxide, and chlorine gas. The following table lists limits for harmful gases.
Table 2-2
Requirements for Gases
Gas
Sulfur dioxide (SO
Hydrogen sulfide (H
Nitrogen dioxide (NO
Chlorine gas (CI
Note
"Average" indicates the typical level of exposure over a one-week period. "Maximum" refers to the highest
allowable exposure level within a week, with this level being sustainable for no more than 30 minutes per day.
2.2.6
Grounding Requirements
A proper grounding system is crucial for ensuring stable and reliable operation of the device, as well as
preventing lightning strikes and interference. To ensure proper grounding, carefully check the grounding
Unit
Particles/m3
Particles/m3
Average (mg/m3)
)
0.3
2
S)
0.1
2
)
0.5
2
)
0.1
2
Concentration
≤ 3.5×106
≤ 3.5×104
9
Preparing for Installation
Maximum (mg/m3)
1.0
0.5
1.0
0.3
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