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24 Basic External Connection Diagram
1.2–3.6 V
+
or
C
PW1
∗1
2.4–3.6 V
C
PW2
C
PW3
C
CV
∗2
C
∗3
C
LCD1
LCD1
C
C
LCD2
LCD2
C
LCD3
C
C
LCD4
LCD4
C
C
LCD5
LCD5
C
LCD6
Open
(
)
C
G1
( )
C
D1
( )
∗4
∗5
C
R
G3
CR3
( )
C
D3
*1: For Flash programming
*2: When 1/3 bias is selected
*3: When 1/4 bias is selected
*4: When OSC3 CR oscillator is selected
*5: When OSC3 crystal/ceramic oscillator is selected
*6: The SEG24–SEG47 pins do not exist in the 64-pin package. (24SEG × 4COM/20SEG × 8COM)
The SEG28–SEG34 and SEG39–SEG47 pins do not exist in the 80-pin package. (32SEG × 4COM/28SEG × 8COM)
*7: The V
, C
, and C
pins do not exist in the 64-pin and 80-pin packages.
D2
V1
V2
( ): Do not mount components if unnecessary.
S1C17W18 TECHNICAL MANUAL
(Rev. 1.2)
48SEG × 4COM/44SEG × 8COM
V
DD
V
D1
∗7
V
D2
∗7
C
V1
∗7
C
V2
V
C1
V
C2
V
C3
V
C4
C
P1
C
P2
S1C17W18
C
P3
C
P4
[The potential of the substrate
OSC1
(back of the chip) is V
OSC2
X'tal1
OSC3
OSC4
X'tal3/
Ceramic
#RESET
V
SS
Seiko Epson Corporation
24 BASIC EXTERNAL CONNECTION DIAGRAM
LCD panel
∗6
∗6
EXSVD
BZOUT
.]
SS
SPICLKn
#SPISSn
USOUTn
TOUTn0/CAPn0
TOUTn1/CAPn1
ADIN00–06
#ADTRG0
VREFA0
V
DD
BZ
V
DD
R
SENBn
TMP2
R
SENAn
TMP1
R
REFn
REF
RFINn
C
REF
V
DD
REMO
IR transmitter module
R
DBG
V
(
)
DD
DCLK
DSIO
DST2
V
PP
C
VPP
Pxy
I/O
SDIn
SDOn
SPI
SCL0
I
2
C
SDA0
USINn
UART
PWM/Capture
A/D conversion inputs
( )
C
VREFA
ICDmini
24-1
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