2.6
Module Footprint
Figure 8 shows the dimensions of the module footprint on the base board.
The maximum component height under the module is dependent on the connector type - refer to Section
2.8 for detailed connector information.
Figure 8: Module Footprint - Top View
The footprint of the module connector is available for different PCB design tools (Altium, Eagle, Orcad, PADS)
[7].
2.7
Mechanical Data
Table 3 describes the mechanical characteristics of the Mars AX3 FPGA module. A 3D model (PDF) and a
STEP 3D model are available [8], [9].
Symbol
Size
Component height top
Component height bottom
Weight
Table 3: Mechanical Data
2.8
Module Connector
The Mars AX3 FPGA module fits into a 200-pin DDR2 SO-DIMM (1.8 V) socket. Up to four M2 screws may
be used to mechanically fasten the module to the base board. Do not use excessive force to tighten the
screws, as this could damage the module.
D-0000-426-004
Value
67.6
30 mm
2.0 mm
0 mm
8 g
14 / 47
Version 06, 16.02.2021
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