Absolute Maximum Ratings; Thermal Resistance; Esd Caution - Analog Devices AD9776A Manual

ABSOLUTE MAXIMUM RATINGS

Table 5.
Parameter With Respect To
AVDD33, DVDD33 AGND, DGND,
CGND
DVDD18, CVDD18 AGND, DGND,
CGND
AGND DGND, CGND
DGND AGND, CGND
CGND AGND, DGND
I120, VREF, IPTAT AGND
OUT1_P, OUT1_N, AGND
OUT2_P, OUT2_N,
AUX1_P, AUX1_N,
AUX2_P, AUX2_N
P1D[15:0], P2D[15:0] DGND
DATACLK, TXENABLE DGND
REFCLK+, REFCLK− CGND
RESET, IRQ, PLL_LOCK, DGND
SYNC_O+, SYNC_O−,
SYNC_I+, SYNC_I−,
CSB, SCLK, SDIO, SDO
Junction Temperature
Storage Temperature
Range
Stresses above those listed under Absolute Maximum Ratings
Rating
may cause permanent damage to the device. This is a stress
−0.3 V to +3.6 V
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
−0.3 V to +2.1 V
section of this specification is not implied. Exposure to absolute
−0.3 V to +0.3 V
maximum rating conditions for extended periods may affect
−0.3 V to +0.3 V
device reliability.
−0.3 V to +0.3 V

THERMAL RESISTANCE

−0.3 V to
For optimal thermal performance, the exposed paddle (EPAD)
AVDD33 + 0.3 V
should be soldered to the ground plane for the 100-lead,
−1.0 V to
AVDD33 + 0.3 V
thermally enhanced TQFP package.
Typical θ
Airflow increases heat dissipation, effectively reducing θ
−0.3 V to
DVDD33 + 0.3 V
Table 6. Thermal Resistance
−0.3 V to
Package Type
DVDD33 + 0.3 V
100-Lead TQFP
−0.3 V to
CVDD18 + 0.3 V
−0.3 V to
DVDD33 + 0.3 V

ESD CAUTION

+125°C
−65°C to +150°C
Rev. B | Page 9 of 56
AD9776A/AD9778A/AD9779A
and θ are specified for a 4-layer board in still air.
JA JC
EPAD Soldered
EPAD Not Soldered
.
JA
θ θ θ Unit
JA JB JC
19.1 12.4 7.1 °C/W
27.4 °C/W