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Intel® Server Board M50CYP2SB Family Technical Product Specification
2.
Server Board Family Overview
This chapter identifies the board's features and functions, provides mechanical dimensional diagrams, and
an overview of each board architecture.
2.1
Server Board Feature Set
The following table provides a high-level overview of the Intel® Server Board M50CYP2SB family.
Feature
Server Board
Server Board
Dimensions
Processor Support
Maximum Supported
Processor Thermal
Design Power (TDP)
PCH Chipset
Memory Support
System Fan Support
Onboard Network
Support
16
Table 2. Intel® Server Board M50CYP2SB Family Features
Details
• Intel® Server Board M50CYP2SBSTD and Intel® Server Board M50CYP2SB1U
• 477.36 mm length x 427.98 mm width x 1.93 mm thickness
• Dual Socket-P4 LGA4189
• Supported 3
rd
Gen Intel® Xeon® Scalable processor family SKUs:
Intel® Xeon® Platinum 8300 processor
o
Intel® Xeon® Gold 6300 processor
o
Intel® Xeon® Gold 5300 processor
o
Intel® Xeon® Silver 4300 processor
o
Note: Supported 3
rd
Gen Intel® Xeon® Scalable processor SKUs must Not end in (H), (L), (U), (Q), or (M).
All other processor SKUs are supported.
• Intel® UPI links: up to three at 11.2 GT/s (Platinum and Gold families) or up to two at 10.4 GT/s (Silver
family)
Note: Previous generation Intel® Xeon® processors are not supported.
• 3
rd
Gen Intel® Xeon® Scalable processors can operate up to 270 W (server board only)
Note: The maximum supported processor TDP at the system level may be lower than what the server
board can support. Supported power, thermal, and configuration limits of the chosen server chassis
need to be considered to determine if the system can support the maximum processor TDP limit of the
server board. Refer to the server chassis/system documentation for additional guidance.
• Intel® C621A Platform Controller Hub (PCH) chipset
•
Embedded features enabled on this server board:
o
SATA support
o
USB support
PCIe support
o
• 32 DIMM slots
o 16 DIMM slots per processor, eight memory channels per processor
o Two DIMMs per channel
• All DDR4 DIMMs must support ECC
• Registered DDR4 (RDIMM), 3DS-RDIMM, Load Reduced DDR4 (LRDIMM), 3DS-LRDIMM
Note: 3DS = 3 Dimensional Stacking
• Intel® Optane™ persistent memory 200 series
• Memory capacity
o Up to 6 TB per processor (processor SKU dependent)
• Memory data transfer rates
o Up to 3200 MT/s at one or two DIMMs per channel (processor SKU dependent)
• DDR4 standard voltage of 1.2V
• Six 6-pin fan connectors (Intel® Server Board M50CYP2SBSTD)
• Eight 8-pin fan connectors (Intel® Server Board M50CYP2SB1U and M50CYP2SBSTD)
• CPU fan headers (one for each CPU)
Provided by optional Open Compute Project (OCP*) module support. See below.
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