Intel M50CYP2SB Series Technical Specification page 153

Intel® Server Board M50CYP2SB Family Technical Product Specification
Feature Details
• 32 DIMM slots
• All DDR4 DIMMs must support ECC
• Registered DDR4 (RDIMM), 3DS-RDIMM, Load Reduced DDR4 (LRDIMM), 3DS-LRDIMM
Memory Support
• Intel® Optane™ persistent memory 200 series
• Memory capacity
• Memory data transfer rates
• DDR4 standard voltage of 1.2V
• Eight managed 40 mm hot swap capable system fans
• Integrated fans included with each installed power supply module
System Fans
Note: System fan redundancy is supported on specific system configurations.
The server system can have up to two power supply modules installed, supporting the following power
configurations: 1+0, 1+1 redundant power, and 2+0 combined power.
Power Supply
Three power supply options:
Options
• AC 1300 W Titanium
• AC 1600 W Titanium
Server Board
See optional Open Compute Project (OCP*) adapter support below.
Network Support
Onboard x16 PCIe* 4.0 OCP 3.0 Mezzanine connector (Small Form-Factor) supports the following Intel
accessory options:
Open Compute
• Dual port, RJ45, 10/1 GbE, - iPC- X710T2LOCPV3
Project* (OCP*)
• Quad port, SFP+ DA, 4x 10 GbE - iPC- X710DA4OCPV3
Adapter Support
• Dual Port, QSFP28 100/50/25/10 GbE - iPC- E810CQDA2OCPV3
• Dual Port, SFP28 25/10 GbE - iPC-E810XXVDA2OCPV3
o 16 DIMM slots per processor, eight memory channels per processor
o Two DIMMs per channel
Note: 3DS = 3 Dimensional Stacking
o Up to 6 TB per processor (processor SKU dependent)
o Up to 3200 MT/s at one or two DIMMs per channel (processor SKU dependent)
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