Thermal Specifications; Boxed Processor Cooling Requirements; Baseboard Power Header Placement Relative To Processor Socket - Intel BX80562QX6700 - Core 2 Extreme 2.66 GHz Processor Datasheet

Figure 27.

Baseboard Power Header Placement Relative to Processor Socket

7.3

Thermal Specifications

This section describes the cooling requirements of the fan heatsink solution used by the
boxed processor.
7.3.1

Boxed Processor Cooling Requirements

The boxed processor may be directly cooled with a fan heatsink. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
temperature specification is in
keep the processor temperature within the specifications (see
provide good thermal management. For the boxed processor fan heatsink to operate
properly, it is critical that the airflow provided to the fan heatsink is unimpeded. Airflow
of the fan heatsink is into the center and out of the sides of the fan heatsink. Airspace
is required around the fan to ensure that the airflow through the fan heatsink is not
blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and
decreases fan life.
for the fan heatsink. The air temperature entering the fan should be kept below 39 ºC.
Again, meeting the processor's temperature specification is the responsibility of the
system integrator.
92
Chapter 5. The boxed processor fan heatsink is able to
Figure 28 and Figure 29
Boxed Processor Specifications
Table
illustrate an acceptable airspace clearance
26) in chassis that
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