Specifications; Physical Specifications; Table 2-4. Weight And Footprint Dimensions - ADLINK Technology CoreModule 745 Reference Manual

Chapter 2

Specifications

Physical Specifications

Table 2-4 provides the physical dimensions of the CoreModule 745.

Table 2-4. Weight and Footprint Dimensions

Item Dimension
Weight 0.12 kg (0.25 lbs)
Height (overall) 11.05 mm (0.435 inches)
Board thickness 2.362 mm (0.093 inches)
Width 96.01 mm (3.78 inches)
Length 115.57 mm (4.55 inches)
14
NOTE Overall height is measured from the
upper board surface to the highest
permanent component (PC/104 bus
connector) on the upper board surface.
This measurement does not include the
heatsink, which can vary. The heatsink
could increase this dimension.
Component height should not exceed
0.345" (8.763mm) from the upper
surface of the board and 0.190"
(4.826mm) from the lower surface of the
board. See
heights of the heatsinks on the board.
Reference Manual
Product Overview
Figure 2-9 for the stack
CoreModule 745