Thermal Connection; Fig. 5-2 Fetk-S1.1 Connection To The Ecu - ETAS FETK-S1.1 User Manual

Emulator probe for infineon aurix mcu family
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ETAS
Fig. 5-2
5.2

Thermal Connection

The ECU housing should be of a size and material, which gives a thermal con-
ductivity of 2.5 W/ (m · K ) at the FETK-S1.1 mounting position.
If this value cannot be achieved, additional cooling structures, e.g. heat sinks,
should be applied.
The use of heat conductive paste with a thermal conductivity > 0.75 W/
(m · K) between heat spreader and housing is strongly recommended.
FETK-S1.1 - User's Guide
FETK-S1.1 Connection to the ECU
CAUTION
Installation
30

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