Octo-Spi Memory Devices; Description; Operating Voltage; Octo-Spi I/O Interface - ST STM32L562E-DK User Manual

6.12

Octo-SPI memory devices

6.12.1

Description

MX25LM51245GXDI00, a 512-Mbit Octal-SPI Flash memory device, is fitted on STM32L562E-DK, in the U6
position. It is used when evaluating the STM32L562QEI6QU Octo-SPI interface.
MX25LM51245GXDI00 can operate in both single (STR) and double (DTR) transfer-rate modes.
6.12.2

Operating voltage

The voltage of the MX25LM51245GXDI00 Octo-SPI Flash memory device is in the range of 2.7 to 3.6 V.
The OCTO-SPI memory does not support the low voltage MCU 1.8 V.
6.12.3

Octo-SPI I/O interface

Table 22 describes the HW configuration for the Octo-SPI interface.
I/O
PA2
PA3
PA6
PA7
PB0
PB1
PB2
PC0
PC1
PC2
PC3
NRST
6.13
Bluetooth
6.13.1 Description
The STM32L562E-DK Discovery kit supports a Bluetooth
supported by the STM module SPBTLE-RFTR. This module is driven by an SPI interface.
The Bluetooth antenna is integrated into the SPBTLE-RFTR module.
6.13.2 Operating voltage
The SPBTLE module supports the voltage range from 1.8 to 3.3 V.
6.13.3

BLE I/O interface

Table 23 describes the I/O configuration for the BLE interface.
I/O
PG8
PG6
UM2617 - Rev 2
Table 22. I/O configuration for the Octo-SPI interface
PA2 is connected to Octo-SPI FLASH as NCS.
PA3 is connected to Octo-SPI FLASH as CLK.
PA6 is connected to Octo-SPI FLASH as IO3.
PA7 is connected to Octo-SPI FLASH as IO2.
PB0 is connected to Octo-SPI FLASH as IO1.
PB1 is connected to Octo-SPI FLASH as IO0.
PB2 is connected to Octo-SPI FLASH as DQS.
PC0 is connected to Octo-SPI FLASH as IO7.
PC1 is connected to Octo-SPI FLASH as IO4.
PC2 is connected to Octo-SPI FLASH as IO5.
PC3 is connected to Octo-SPI FLASH as IO6.
NRST is connected to Octo-SPI FLASH as RESET.
®
Low Energy (BLE)
Table 23. I/O configuration for the BLE I/O interface
PG8 is connected to BLE_RSTN.
PG6 is connected to BLE_INT.
Configuration
®
Low Energy module (BLE) V4.1. This function is
Configuration
UM2617
Octo-SPI memory devices
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