Thermal Requirements - SMART Embedded Computing ATCA-F140 Series Installation And Use Manual

Hardware Preparation and Installation
Table 2-1
Requirement Operating
Vibration
Shock
Free Fall
2.3.2

Thermal Requirements

In order for the ATCA-F140 to cool properly when the operating temperature is at the
maximum (55
Chassis Specification. PICMG 3.7 R1 Class B.4 compliance is preferred.
Contact your SMART Embedded Computing sales representative for current information
on the detailed thermal information including airflow and resistance of the blade.
System Overheating - Cooling Vents
Improper cooling can lead to system damage and can void the manufacturer's
warranty.
To ensure proper cooling and undisturbed airflow through the system, do not
obstruct the ventilation openings of the system. Make sure that the fresh air supply
is not mixed with hot exhaust from other devices.
Personal Injury
During operation, hot surfaces may be present on the heat sinks and the
components of the product.
To prevent injury from hot surface, do not touch any of the exposed components or
heatsinks on the product when handing. Use the handle and face plate, where
applicable, or the board edge when removing the product from the enclosure.
50
Environmental Requirements (continued)
1g from 5 to 200Hz and back to 5Hz at
a rate of 0.25 octave/minute
(according to Telcordia GR-63-core)
Half-sine, 11ms at 30m/s
NA
C), the chassis must meet or exceed PICMG 3.7 R1 Class B.3 ATCA
°
Hardware Preparation and Installation
Non-Operating
5-20Hz at 0.01 g
Telcordia GR-63-core and ETSI EN 300
019-2-2)
20-200Hz at -3dB/octave Hz (according
to Telcordia GR-63-core and ETSI EN
300 019-2-2)
Random 5-20Hz at 1m
Random 20-200Hz at 3m
Blade level packaging
2
Half-sine, 6ms at 180m/s
1.2 m/ packaged (according to ETSI 300
019-2-2)
100 mm unpackaged (according to
Telcordia GR-63-core)
ATCA-F140 Series Installation and Use (6806800M67S)
2
/Hz (according to
2 3
/s
2 3
/s
2