WAGO-I/O-SYSTEM 750
750-496 8AI 0/4-20mA S.E.
Pos : 20.7 /All e Seri en ( Allgemei ne Module)/Ü bers chriften/Ebene 2/Ansc hlüss e - Ü bersc hrift 2 @ 4\mod_1240984262656_21.doc x @ 31961 @ 2 @ 1
3.2
Connectors
Pos : 20.8 /Serie 750 (WAGO-I/O-SYST EM)/Ger ätebesc hrei bung/Ansc hl üsse/Datenkontakte/Kl emmenbus - Ü bersc hrift 3 @ 6\mod_1256294684083_21.doc x @ 43660 @ 3 @ 1
3.2.1
Data Contacts/Internal Bus
Pos : 20.9.1 /Serie 750 (WAGO-I/O-SYST EM)/Gerätebesc hrei bung/Ansc hlüsse/Datenkontakte - F eldbus koppler/-c ontroller , Abbildung und Besc hrei bung @ 3\mod_1231771259187_21.doc x @ 26002 @ @ 1
Communication between the fieldbus coupler/controller and the I/O modules as
well as the system supply of the I/O modules is carried out via the internal bus. It
is comprised of 6 data contacts, which are available as self-cleaning gold spring
contacts.
Figure 2: Data Contacts
Pos : 20.9.2 /Serie 750 (WAGO-I/O-SYST EM)/Wichtige Erläuterungen/Sic herheits- und sonstige Hinweis e/Achtung/Achtung: Bus kl emmen nic ht auf Gol dfeder kontakte leg en! @ 7\mod_1266318463636_21.doc x @ 50695 @ @ 1
Do not place the I/O modules on the gold spring contacts!
Do not place the I/O modules on the gold spring contacts in order to avoid soiling
or scratching!
Pos : 20.9.3 /Serie 750 (WAGO-I/O-SYST EM)/Wichtige Erläuterungen/Sic herheits- und sonstige Hinweis e/Achtung/Achtung: ESD - Auf g ute Erdung der Umg ebung ac hten! @ 7\mod_1266318538667_21.doc x @ 50708 @ @ 1
Ensure that the environment is well grounded!
The devices are equipped with electronic components that may be destroyed by
electrostatic discharge. When handling the devices, ensure that the environment
(persons, workplace and packing) is well grounded. Avoid touching conductive
components, e.g. data contacts.
Pos : 20.10 /D okumentati on allgemei n/Gli ederungsel emente/---Seitenwec hs el--- @ 3\mod_1221108045078_0.doc x @ 21810 @ @ 1
Manual
Version 1.2.0
Device Description
17