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18 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8349EA is available
in a tape ball grid array (TBGA). See
and
Section 18.2, "Mechanical Dimensions of the MPC8349EA
18.1
Package Parameters for the MPC8349EA TBGA
The package parameters are provided in the following list. The package type is 35 mm × 35 mm, 672 tape
ball grid array (TBGA).
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
Section 18.1, "Package Parameters for the MPC8349EA
35 mm × 35 mm
672
1.00 mm
1.46 mm
62 Sn/36 Pb/2 Ag (ZU package)
95.5 Sn/0.5 Cu/4Ag (VV package)
0.64 mm
Package and Pin Listings
TBGA."
TBGA,"
75
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