Package And Pin Listings - Freescale Semiconductor MPC8349E PowerQUICC II Pro Hardware Specifications

Package and Pin Listings

18 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8349E is available in
a tape ball grid array (TBGA). See
Section 18.2, "Mechanical Dimensions for the MPC8349E TBGA."
18.1 Package Parameters for the MPC8349E TBGA
The package parameters are provided in the following list. The package type is 35 mm × 35 mm, 672 tape
ball grid array (TBGA).
Package outline
Interconnects
Pitch
Module height (typical)
Solder balls
Ball diameter (typical)
MPC8349E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 10
54
Section 18.1, "Package Parameters for the MPC8349E TBGA"
35 mm × 35 mm
672
1.00 mm
1.46 mm
62 Sn/36 Pb/2 Ag (ZU package)
95.5 Sn/0.5 Cu/4Ag (VV package)
0.64 mm
and
Freescale Semiconductor