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Specifications are subject to change without notice
13-2 Pre-process and Heat Treatment
Procedure: (MRT L3)
[Package opening]
A.
Conditions between each step of procedure
Be lift for duration of 2 hours or longer at temperature of 30
or lower.
B.
Baking 125
C.
Humidification: 30
D.
Reflow: 3 x 260
14
Manual Solder Condition
The specimen should be in the as-delivered condition. Set the soldering iron at a temperature of 300 +/- 10
(at the iron bit). Place the iron and flux-cored solder in parallel with each and every terminal/lead on the back
of the board for a duration which does not exceed 5 seconds without applying any mechanical stress on the
component body.
It can also be applied under 350 +/- 10
condition.
The chip can't do DIP soldering.
15
Storage Condition
15-1 Storage Duration
A.
Notice the Sealing time.
B.
12 monthly and storage condition: <= 40
C.
Warehouse control: First in and First out.
15-2 After Open the Bag
A.
SMT: Should finish the SMT process within 168 hours
B.
Check the humidity check card: The value should < 20% (blue), if the value >= 30% (red), it means
the IC has got moisture.
C.
Factory environment control: <= 30
16
Other
If a doubt related to the present specifications arises, the problem will be solved based on discussion between
the both parties.
[Baking]
[Humidification]
o
C, 24 hours.
o
C, 60% R.H., 192 Hours
o
C
o
C at the iron bit within 3 seconds, please treat it carefully under such
o
C, <= 60% R.H.
MEDIATEK CONFIDENTIAL, NO DISCLOSURE
[Reflow]
o
C or lower and a humidity of 60% R.H.
o
C , <= 90% R.H.
40
o
C
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