Hyundai H-HT5115-N Service Manual page 43

Specifications are subject to change without notice
13
Solder-Reflow Condition
13-1 Reflow Condition
MediaTek can guarantee 3 times IR reflow based on the reflow profile (Figure 1).
Average ramp-up rate (Ts to peak): 3
Preheat & Soak: Pb-Free 150~200
Liquidous temperature maintained above Pb-Free 217
o
Time within 5 C of specified classification temperature: Pb-Free 30 seconds (SnPb Eutectic 20 seconds)
Note:
Reflow profiles in this document are for classification/preconditioning and are not meant to specify
board assembly profiles. Actual board assembly profiles should be developed based on specific
process needs and board designs and should not exceed the parameters in Table 1.
For example, if Tc is 260
user.
For a supplier: The peak temperature must be at least 260
least 30 seconds.
For a user: The peak temperature must not exceed 260
30 seconds.
Peak temperature: Defined in Table 2-1 and Table 2-2.
Ramp-down rate: 6
o
Time 25 C to peak temperature: Pb-Free: 8 minutes max. (SnPb Eutectic 6 minutes max.)
Time between reflows: 5 minutes minimum and 60 minutes maximum
o
C /sec. max.
o
C (SnPb Eutectic 100~150
o
C and time tp is 30 seconds, this means the following for the supplier and
o
C /sec. max.
MEDIATEK CONFIDENTIAL, NO DISCLOSURE
o
C) for 60~120 seconds
o
C (SnPb Eutectic 183
o
C. The time above 255
o
C. The time above 255
38
o
C) for 60~150 seconds
o
C must be at
o
C must not exceed