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4.1.15 REPLACEMENT PROCEDURE
FOR LEADLESS (CHIP) COMPONENTS
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The following procedures are recommended for the replacement of the leadless components used in
this unit.
1. Preparation for replacement
A. Soldering Iron
Use a pencil-type soldering iron that uses less than 30 watts.
B. Solder
Eutectic Solder (Tin 63%, Lead 37%) is recommended.
C. Soldering time
Do not apply heat for more than 4 seconds.
D. Preheating
Leadless capacitor must be preheated before installation. -(266°F ~ 302°F)
(130°C ~150°C) for about two minutes.
Note:
a. Leadless components must not be reused after removal.
b. Excessive mechanical stress and rubbing of the component electrode must be avoided.
2. Removing the leadless component
Grasp the leadless component body with tweezers and alternately apply heat to both electrodes.
When the solder on both electrodes is melted, remove the leadless component with a twisting
motion.
Note:
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