Intel BX80605X3440 - Quad Core Xeon X3440 Reference
Lga1156 socket thermal/mechanical specifications and design guidelines
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Summary of Contents for Intel BX80605X3440 - Quad Core Xeon X3440
- Page 1 ® ® Intel Xeon Processor 3400 Series and LGA1156 Socket Thermal/Mechanical Specifications and Design Guidelines September 2009 Reference Number: 322374-001...
- Page 2 See www.intel.com/products/processor_number for details. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Xeon, Intel Flexible Display Interface, Intel Core, Intel Thermal Monitor, and the Intel logo are trademarks of Intel Corporation in the U.S and other countries.
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Page 3: Table Of Contents
Contents Introduction ......................7 References ......................7 Definition of Terms ....................8 Package Mechanical and Storage Specifications............11 Package Mechanical Specifications ............... 11 Processor Storage Specifications ................. 16 LGA1156 Socket ...................... 17 Board Layout ....................19 LGA1156 Socket NCTF Solder Joints..............20 Attachment to Motherboard ................ - Page 4 ILM Assembly ......................30 Pin 1 and ILM Lever....................31 Flow Chart of Knowledge-Based Reliability Evaluation Methodology ......36 ® ® Thermal Test Vehicle Thermal Profile for Intel Xeon Processor 3400 Series (95W) ..39 ® ® Thermal Test Vehicle Thermal Profile for Intel Xeon Processor 3400 Series (45W) ..41...
- Page 5 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor 3400 Series (45W) ..41 ® ® Thermal Solution Performance above TCONTROL for the Intel Xeon Processor 3400 Series (95W) ................42 ® ® Thermal Solution Performance above TCONTROL for the Intel Xeon Processor 3400 Series (45W) ................
- Page 6 Document Revision Description Revision Date Number Number 322374 -001 • Initial release September 2009 § Thermal/Mechanical Specifications and Design Guidelines...
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Page 7: Introduction
• The collaboration design thermal solution (heatsink) for the processors and associated retention hardware. ® ® The Intel Xeon processor 3400 series has two thermal specifications. When required for clarity this document will use Intel ® Xeon ® processor 3400 series (95W) or Intel ® Xeon ®... -
Page 8: Definition Of Terms
The processor mates with the system board through this surface mount, 1156-land socket. PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices. Case-to-ambient thermal characterization parameter (psi). A measure of thermal Ψ... - Page 9 Introduction Table 1-2. Terms and Descriptions (Sheet 2 of 2) Term Description Thermal Test Vehicle. A mechanically equivalent package that contains a resistive heater in the die to evaluate thermal solutions. The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink.
- Page 10 Introduction Thermal/Mechanical Specifications and Design Guidelines...
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Page 11: Package Mechanical And Storage Specifications
Package Mechanical and Storage Specifications Package Mechanical and Storage Specifications Package Mechanical Specifications The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with the motherboard via the LGA1156 socket. The package consists of a processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor thermal solutions, such as a heatsink. -
Page 12: Package View
Package Mechanical and Storage Specifications 2.1.1 Package Mechanical Drawing Figure 2-2 shows the basic package layout and dimensions. The detailed package mechanical drawings are in Appendix D. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include: 1. -
Page 13: Processor Loading Specifications
Package Mechanical and Storage Specifications 2.1.3 Package Loading Specifications Table 2-1 provides dynamic and static load specifications for the processor package. These mechanical maximum load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any mechanical system or component testing should not exceed the maximum limits. -
Page 14: Processor Top-Side Markings
Figure 2-3 shows the topside markings on the processor. This diagram is to aid in the identification of the processor. Figure 2-3. Processor Top-Side Markings Legend: Mark Text (Production Mark): INTEL{M}{C}'08 PROC# GRP1LINE1 BRAND GRP1LINE2 SLxxx C00 GRP1LINE3 SPEED/CACHE/FMB GRP1LINE4... -
Page 15: Processor Package Lands Coordinates
Package Mechanical and Storage Specifications 2.1.9 Processor Land Coordinates Figure 2-4 shows the bottom view of the processor package. Figure 2-4. Processor Package Lands Coordinates 25 27 29 31 33 35 37 39 11 13 15 17 19 21 23 26 28 30 32 34 36 38 40 10 12 14 16 18 20 22 24 Thermal/Mechanical Specifications and Design Guidelines... -
Page 16: Processor Storage Specifications
Nominal temperature and humidity conditions and durations are given and tested within the constraints imposed by T and customer shelf life in applicable Intel box and bags. SUSTAINED § Thermal/Mechanical Specifications and Design Guidelines... -
Page 17: Lga1156 Socket
LGA1156 Socket LGA1156 Socket This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the processors. The socket provides I/O, power, and ground contacts. The socket contains 1156 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard. -
Page 18: Lga1156 Socket Contact Numbering (Top View Of Socket)
LGA1156 Socket Figure 3-2. LGA1156 Socket Contact Numbering (Top View of Socket) U W AA AC AE AG AJ AL AN AR AU AW U W AA AC AE AG AJ AL AN AR AU AW U W AA AC AE AG AJ AL AN AR AU AW U W AA AC AE AG AJ AL AN AR AU AW Y AB AD AF AH AK AM AP AT AV AY Y AB AD AF AH AK AM AP AT AV AY... -
Page 19: Board Layout
LGA1156 Socket Board Layout The land pattern for the LGA1156 socket is 36 mils X 36 mils (X by Y) within each of the two L-shaped sections. Note that there is no round-off (conversion) error between socket pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The two L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm (122.6 mil) in the y direction (see Figure... -
Page 20: Lga1156 Socket Nctf Solder Joints
LGA1156 Socket LGA1156 Socket NCTF Solder Joints Intel has defined selected solder joints of the socket as non-critical to function (NCTF) when evaluating package solder joints post environmental testing. The signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality. -
Page 21: Attachment To Motherboard
LGA1156 Socket Attachment to Motherboard The socket is attached to the motherboard by 1156 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, etc.) to attach the socket. As indicated in Figure 3-1, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process. -
Page 22: Solder Balls
LGA1156 Socket 3.4.2 Solder Balls A total of 1156 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard. The socket solder ball has the following characteristics: • Lead free SAC (SnAgCu) 305 solder alloy with a silver (Ag) content between 3% and 4% and a melting temperature of approximately 217 °C. -
Page 23: Package Installation / Removal
LGA1156 Socket Figure 3-6. Pick and Place Cover Pin 1 Pin 1 Pick & Place Cover Pick & Place Cover ILM Installation ILM Installation Package Installation / Removal As indicated in Figure 3-7, access is provided to facilitate manual installation and removal of the package. -
Page 24: Durability
LGA1156 Socket Figure 3-7. Package Installation / Removal Features Package Orientation Pin 1 Notch Indicator (2 Places) Finger Access (2 Places) Alignment Post Pin 1 (2 Places) Chamfer 3.5.1 Socket Standoffs and Package Seating Plane Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Appendix Similarly, a seating plane on the top-side of the socket establishes the minimum... -
Page 25: Markings
LGA1156 Socket Markings There are three markings on the socket: • LGA1156: Font type is Helvetica Bold - minimum 6 point (2.125 mm). • Manufacturer's insignia (font size at supplier's discretion). • Lot identification code (allows traceability of manufacturing date and location). All markings must withstand 260°C for 40 seconds (typical reflow/rework profile) without degrading, and must be visible after the socket is mounted on the motherboard. - Page 26 LGA1156 Socket Thermal/Mechanical Specifications and Design Guidelines...
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Page 27: Independent Loading Mechanism (Ilm)
Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be “build to print” from Intel controlled drawings. Intel recommends using the Intel Reference ILM. -
Page 28: Ilm Cover Assembly
Independent Loading Mechanism (ILM) When closed, the load plate applies two point loads onto the IHS at the “dimpled” features shown in Figure 4-1. The reaction force from closing the load plate is transmitted to the hinge frame assembly and through the fasteners to the back plate. Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints. -
Page 29: Shoulder Screw
Independent Loading Mechanism (ILM) 4.1.3 Shoulder Screw and Fasteners Design Overview The shoulder screw is fabricated from carbonized steel rod. The shoulder height and diameter are integral to the mechanical performance of the ILM. The diameter provides alignment of the load plate. The height of the shoulder ensures the proper loading of the IHS to seat the processor on the socket contacts. -
Page 30: Assembly Of Ilm To A Motherboard
Independent Loading Mechanism (ILM) Assembly of ILM to a Motherboard The ILM design allows a bottoms up assembly of the components to the board. See Figure 4-4 for step by step assembly sequence. 1. Place the back plate in a fixture. The motherboard is aligned with the fixture. 2. -
Page 31: Ilm Interchangeability
Note: Desktop and Server ILM backplate/screws are NOT interchangeable. Note: ILMs that are not compliant with the Intel controlled ILM drawings can not be assured to be interchangeable. Thermal/Mechanical Specifications and Design Guidelines... -
Page 32: Markings
Independent Loading Mechanism (ILM) Markings There are four markings on the ILM: • 115XLM: Font type is Helvetica Bold - minimum 6 point (2.125 mm). • Manufacturer's insignia (font size at supplier's discretion). • Lot identification code (allows traceability of manufacturing date and location). •... -
Page 33: Lga1156 Socket And Ilm Electrical, Mechanical, And Environmental Specifications
LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications This chapter describes the electrical, mechanical, and environmental specifications for the LGA1156 socket and the Independent Loading Mechanism. Component Mass Table 5-1. Socket Component Mass Component Mass... -
Page 34: Loading Specifications
This is the minimum and maximum static force that can be applied by the heatsink and it’s retention solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated to these limits. -
Page 35: Electrical Requirements
LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications Electrical Requirements LGA1156 socket electrical requirements are measured from the socket-seating plane of the processor to the component side of the socket PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated. -
Page 36: Environmental Requirements
Freeze stressing Perform stressing to requirements and perform validate accelerated additional data turns stressing assumptions and determine acceleration factors A detailed description of this methodology can be found at: ftp://download.intel.com/ technology/itj/q32000/pdf/reliability.pdf. § Thermal/Mechanical Specifications and Design Guidelines... -
Page 37: Thermal Specifications
1U collaboration thermal solution design, refer to Chapter Thermal Specifications To allow the optimal operation and long-term reliability of Intel processor-based systems, the processor must remain within the minimum and maximum case temperature (T ) specifications as defined by the applicable thermal profile. - Page 38 Core™ 2 Quad Q9000 processor series. The FMB 2009A (09A ) is equivalent to the thermal requirements for the Intel® Core™ 2 Duo E8000 processor series. Reuse of those thermal solutions is recommended with the updated mechanical attach to straddle the LGA1156 socket.
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Page 39: Thermal Test Vehicle Thermal Profile For Intel Xeon Processor 3400 Series (95W)
Thermal Specifications ® ® 6.1.1 Intel Xeon Processor 3400 Series (95W) Thermal Profile Figure 6-1. Thermal Test Vehicle Thermal Profile for Intel ® Xeon ® Processor 3400 Series (95W) TTV Thermal Profile 75.0 Y = Power x 0.29 + 45.1 70.0... -
Page 40: Thermal Test Vehicle Thermal Profile For Intel
Thermal Specifications ® ® Table 6-2. Thermal Test Vehicle Thermal Profile for Intel Xeon Processor 3400 Series (95W) Power (W) (° C) Power (W) (° C) CASE_MAX CASE_MAX 45.1 59.6 45.7 60.2 46.3 60.8 46.8 61.3 47.4 61.9 48.0 62.5 48.6... -
Page 41: Thermal Test Vehicle Thermal Profile For Intel Xeon Processor 3400 Series (45W)
Thermal Specifications ® ® 6.1.2 Intel Xeon Processor 3400 Series (45W) Thermal Profile Figure 6-2. Thermal Test Vehicle Thermal Profile for Intel ® Xeon ® Processor 3400 Series (45W) Notes: Please refer to Table 6-3 for discrete points that constitute the thermal profile. - Page 42 CONTROL algorithm must drive the fan speed to meet or exceed the target thermal solution ® ® performance (Ψ ) shown in Table 6-4 for the Intel Xeon processor 3400 series (95 ® ® Table 6-5 for the Intel Xeon processor 3400 series (45W) .
- Page 43 Thermal Specifications ® ® Table 6-5. Thermal Solution Performance above T for the Intel Xeon Processor CONTROL 3400 Series (45W) Ψ Ψ AMBIENT DTS = T DTS = -1 CONTROL 45.2 0.290 0.289 44.0 0.332 0.316 43.0 0.368 0.338 42.0 0.403...
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Page 44: Processor Thermal Features
The following supplier can machine the groove and attach a thermocouple to the IHS. The supplier is listed the table below as a convenience to Intel’s general customers and the list may be subject to change without notice. THERM-X OF CALIFORNIA, 1837 Whipple Road, Hayward, Ca 94544. - Page 45 Mechanical Design Guidelines for information on designing a compliant thermal solution. The Intel Thermal Monitor does not require any additional hardware, software drivers, or interrupt handling routines. The following sections provide more details on the different TCC mechanisms used by the processor.
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Page 46: Frequency And Voltage Ordering
Clocks often will not be off for more than 32 microseconds when the TCC is active. Cycle times are independent of processor frequency. The duty cycle for the TCC, when activated by the Intel ® Thermal Monitor, is factory configured and cannot be modified. - Page 47 Thermtrip temperature (see Section 6.2.3 Thermtrip Signal) within a short time. In order to prevent possible permanent silicon damage, Intel recommends removing power from the processor within ½ second of the Critical Temperature Flag being set. 6.2.2.5...
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Page 48: Platform Environment Control Interface (Peci)
Introduction The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices. The processor implements a PECI interface to allow communication of processor thermal and other information to other devices on the platform. The processor provides a digital thermal sensor (DTS) for fan speed control. -
Page 49: Temperature Sensor Data Format
Thermal Specifications commands that are commonly implemented include Ping() , GetDIB() and GetTemp(). Table 6-6. Supported PECI Command Functions and Codes Supported on the Command Function Note processor Ping() GetDIB() GetTemp() Note: Thermal management related commands supported by the processor. Common command that will be implemented for system design. -
Page 50: Error Codes And Descriptions
Thermal Specifications Temperature readings from the processor are always negative in a 2’s complement format, and imply an offset from the reference TCC activation temperature. As an example, assume that the TCC activation temperature reference is 100 °C. A PECI thermal reading of -10 indicates that the processor is running at approximately 10 °C below the TCC activation temperature, or 90 °C. -
Page 51: Sensor Based Thermal Specification Design Guidance
Sensor Based Thermal Specification Design Guidance Sensor Based Thermal Specification Design Guidance The sensor based thermal specification presents opportunities for the system designer to optimize the acoustics and simplify thermal validation. The sensor based specification uses the Digital Thermal Sensor information accessed using the PECI interface. -
Page 52: Sensor Based Thermal Specification
Sensor Based Thermal Specification Design Guidance Figure 7-1. Comparison of Case Temperature versus Sensor Based Specification Ta = 45.1 °C Ta = 45.1 °C Tcontrol Tcontrol Ta = 30 °C Ta = 30 °C Ψ-ca = 0.292 Ψ-ca = 0.292 Power Power Current Specification (Case Temp) -
Page 53: Intel ® Xeon ® Processor 3400 Series (95W) Thermal Profile
The TTV is placed in the socket and powered to the recommended value to simulate the TDP condition. See Figure 7-2 for an example of the Intel ® Xeon ® processor 3400 series (95W) TTV thermal profile. -
Page 54: Thermal Solution Design Process
Sensor Based Thermal Specification Design Guidance In the prior thermal specifications this region, DTS values greater than T , was CONTROL defined by the processor thermal profile. This required the user to estimate the processor power and case temperature. Neither of these two data points are accessible in real time for the fan speed control system. -
Page 55: Required Yca For Various Tambient Conditions
Ψ , which can have a lower cost. AMBIENT ® ® Figure 7-3 shows a number of satisfactory solutions for the Intel Xeon processor 3400 series (95W). Note: If the assumed T is inappropriate for the intended system environment, the AMBIENT thermal solution performance may not be sufficient to meet the product requirements. -
Page 56: Fan Speed Control (Fsc) Design Process
Sensor Based Thermal Specification Design Guidance 7.3.2 Thermal Design and Modelling Based on the boundary conditions the designer can now make the design selection of the thermal solution components. The major components that can be mixed are the fan, fin geometry, heat pipe or air duct design. There are cost and acoustic trade-offs the customer can make. - Page 57 Sensor Based Thermal Specification Design Guidance • When DTS i s a bove , FSC algorithms will use knowledge of T CONTROL AMBIENT versus RPM to achieve the necessary level of cooling. Ψ This chapter will discuss two implementations. The first is a FSC system that is not provided the T information and a FSC system that is provided data on the AMBIENT...
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Page 58: System Validation
Sensor Based Thermal Specification Design Guidance System Validation System validation should focus on ensuring the fan speed control algorithm is responding appropriately to the DTS values and T data as well as any other AMBIENT device being monitored for thermal compliance. Since the processor thermal solution has already been validated using the TTV to the thermal specifications at the predicted T , additional TTV based testing in the... -
Page 59: Collaboration Thermal Solution
The collaboration thermal mechanical solution information shown in this document represents the current state of the data and may be subject to modification.The information represents design targets, not commitments by Intel. This section describes the overall requirements for enabled thermal solutions designed ®... -
Page 60: Heatsink Performance Curves
CASE X=Processor Power Value (W) ® ® Table 8-2 shows thermal solution performance is compliant with Intel Xeon processor 3400 series(95W) TTV thermal profile specification. At the TDP(95W) with local ambient of 40°C, there is a 2.4 °C margin. ®... -
Page 61: Heatsink Performance Curves
1U Collaboration Thermal Solution Figure 8-2. 1U Heatsink Performance Curves Table 8-2. Comparison between TTV Thermal Profile and Thermal Solution Performance ® ® for Intel Xeon Processor 3400 Series (95W) (Sheet 1 of 2) Thermal Thermal TTV T TTV T... -
Page 62: Thermal Solution
1U Collaboration Thermal Solution Table 8-2. Comparison between TTV Thermal Profile and Thermal Solution Performance ® ® for Intel Xeon Processor 3400 Series (95W) (Sheet 2 of 2) Thermal Thermal TTV T TTV T CASE_MAX CASE_MAX Power (W) Solution Power (W) Solution (°C) -
Page 63: Assembly
1U Collaboration Thermal Solution Assembly Figure 8-3. 1U Collaboration Heatsink Assembly The assembly process for the 1U collaboration heatsink with application of thermal interface material begins with placing back plate in a fixture. The motherboard is aligned with fixture. Next is to place the heatsink such that the heatsink fins are parallel to system airflow. While lowering the heatsink onto the IHS, align the four captive screws of the heatsink to the four holes of motherboard. -
Page 64: Geometric Envelope For 1U Thermal Mechanical Design
1U Collaboration Thermal Solution Geometric Envelope for 1U Thermal Mechanical Design Figure 8-4. KOZ 3-D Model (Top) in 1U Server 9.5mm Maximum Component Height (5 places) 1.6mm Maximum 2.07mm Maximum Component Height Component Height (2 places) (1 place) 1.2mm Maximum 2.5mm Maximum Component Height Component Height... -
Page 65: Thermal Solution Quality And Reliability Requirements
Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. The Intel collaboration thermal solution will be evaluated to the boundary conditions in... -
Page 66: Recommended Test Sequence
• All enabling components, including socket and thermal solution parts. The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Intel PC Diags is an example of software that can be used for this test. -
Page 67: Material And Recycling Requirements
Thermal Solution Quality and Reliability Requirements Material and Recycling Requirements Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic materials such as PVC formulations, certain polyurethane compositions (such as polyester and some polyethers), plastics that contain organic fillers of laminating materials, paints, and varnishes also are susceptible to fungal growth. - Page 68 Thermal Solution Quality and Reliability Requirements Thermal/Mechanical Specifications and Design Guidelines...
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Page 69: Boxed Processor Specifications
10.1 Introduction The processor will also be offered as an Intel boxed processor. Intel boxed processors are intended for system integrators who build systems from baseboards and standard components. The boxed processor will be supplied with a cooling solution. This chapter documents baseboard and system requirements for the cooling solution that will be supplied with the boxed processor. -
Page 70: Mechanical Specifications
Boxed Processor Specifications 10.2 Mechanical Specifications 10.2.1 Boxed Processor Cooling Solution Dimensions This section documents the mechanical specifications of the boxed processor. The boxed processor will be shipped with an unattached fan heatsink. Figure 10-1 shows a boxed processor fan heatsink. Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. -
Page 71: Space Requirements For The Boxed Processor (Top View)
Boxed Processor Specifications Figure 10-3. Space Requirements for the Boxed Processor (top view) Note: Diagram does not show the attached hardware for the clip design and is provided only as a mechanical representation. Figure 10-4. Space Requirements for the Boxed Processor (overall view) Thermal/Mechanical Specifications and Design Guidelines... -
Page 72: Electrical Requirements
Boxed Processor Specifications 10.2.2 Boxed Processor Fan Heatsink Weight The boxed processor fan heatsink will not weigh more than 450 grams. 10.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly The boxed processor thermal solution requires a heatsink attach clip assembly, to secure the processor and fan heatsink in the baseboard socket. -
Page 73: Thermal Specifications
Boxed Processor Specifications Table 10-1. Fan Heatsink Power and Signal Specifications Description Unit Notes +12 V: 12 volt fan power supply 11.4 12.0 12.6 — — • Maximum fan steady-state current draw — — • Average steady-state fan current draw —... -
Page 74: Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View)
Boxed Processor Specifications Figure 10-7. Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view) Figure 10-8. Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view) Thermal/Mechanical Specifications and Design Guidelines... -
Page 75: Boxed Processor Fan Heatsink Set Points
Boxed Processor Specifications 10.4.2 Variable Speed Fan If the boxed processor fan heatsink 4-pin connector is connected to a 3-pin motherboard header, it will operate as follows: The boxed processor fan will operate at different speeds over a short range of internal chassis temperatures. - Page 76 As processor power has increased the required thermal solutions have generated increasingly more noise. Intel has added an option to the boxed processor that allows system integrators to have a quieter system in the most common usage.
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Page 77: A Component Suppliers
The part numbers listed below identifies the reference components. End-users are responsible for the verification of the Intel enabled component offerings with the supplier. These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. - Page 78 Component Suppliers...
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Page 79: B Mechanical Drawings
Mechanical Drawings Mechanical Drawings Table B-1 lists the mechanical drawings included in this appendix. Table B-1. Mechanical Drawing List Drawing Description Figure Number Socket / Heatsink / ILM Keepout Zone Primary Side for 1U(Top) Figure B-1 Socket / Heatsink / ILM Keepout Zone Secondary Side for 1U(Bottom) Figure B-2 Socket / Processor / ILM Keepout Zone Primary Side for 1U(Top) Figure B-3... -
Page 80: Socket / Heatsink / Ilm Keepout Zone Primary Side For 1U(Top)
Mechanical Drawings Figure B-1. Socket / Heatsink / ILM Keepout Zone Primary Side for 1U(Top) -
Page 81: Socket / Heatsink / Ilm Keepout Zone Secondary Side For 1U(Bottom)
Mechanical Drawings Figure B-2. Socket / Heatsink / ILM Keepout Zone Secondary Side for 1U(Bottom) -
Page 82: Socket / Processor / Ilm Keepout Zone Primary Side For 1U(Top)
Mechanical Drawings Figure B-3. Socket / Processor / ILM Keepout Zone Primary Side for 1U(Top) -
Page 83: Socket / Processor / Ilm Keepout Zone Secondary Side For 1U(Bottom)
Mechanical Drawings Figure B-4. Socket / Processor / ILM Keepout Zone Secondary Side for 1U(Bottom) 25.70 0.00 25.70 18.00 0.00 18.00... -
Page 84: B-5 1U Collaboration Heatsink Assembly
Mechanical Drawings Figure B-5. 1U Collaboration Heatsink Assembly DWG. NO SHT. E49069... -
Page 85: B-6 1U Collaboration Heatsink
Mechanical Drawings Figure B-6. 1U Collaboration Heatsink DWG. NO SHT. E49059... -
Page 86: B-7 1U Collaboration Heatsink Screw
Mechanical Drawings Figure B-7. 1U Collaboration Heatsink Screw DWG. NO SHT. E50686... -
Page 87: Heatsink Compression Spring
Mechanical Drawings Figure B-8. Heatsink Compression Spring... -
Page 88: Heatsink Load Cup
Mechanical Drawings Figure B-9. Heatsink Load Cup... -
Page 89: Heatsink Retaining Ring
Mechanical Drawings Figure B-10. Heatsink Retaining Ring... -
Page 90: Heatsink Backplate Assembly
Mechanical Drawings Figure B-11. Heatsink Backplate Assembly DWG. NO SHT. E49060-001... -
Page 91: Heatsink Backplate
Mechanical Drawings Figure B-12. Heatsink Backplate... -
Page 92: Heatsink Backplate Insulator
Mechanical Drawings Figure B-13. Heatsink Backplate Insulator... -
Page 93: Heatsink Backplate Stud
Mechanical Drawings Figure B-14. Heatsink Backplate Stud DWG. NO SHT. FOXHOLLOW_THICK_BP_STANDOFF... -
Page 94: Thermocouple Attach Drawing
Mechanical Drawings Figure B-15. Thermocouple Attach Drawing... -
Page 95: B-16 1U Ilm Shoulder Screw
Mechanical Drawings Figure B-16. 1U ILM Shoulder Screw... -
Page 96: B-17 1U Ilm Standard 6-32 Thread Fastener
Mechanical Drawings Figure B-17. 1U ILM Standard 6-32 Thread Fastener §... -
Page 97: C Socket Mechanical Drawings
Socket Mechanical Drawings Socket Mechanical Drawings Table C-1 lists the mechanical drawings included in this appendix. Table C-1. Mechanical Drawing List Drawing Description Figure Number “Socket Mechanical Drawing (Sheet 1 of 4)” Figure C-1 “Socket Mechanical Drawing (Sheet 2 of 4)” Figure C-2 “Socket Mechanical Drawing (Sheet 3 of 4)”... -
Page 98: Socket Mechanical Drawing (Sheet 1 Of 4)
Socket Mechanical Drawings Figure C-1. Socket Mechanical Drawing (Sheet 1 of 4) Thermal/Mechanical Specifications and Design Guidelines... -
Page 99: Socket Mechanical Drawing (Sheet 2 Of 4)
Socket Mechanical Drawings Figure C-2. Socket Mechanical Drawing (Sheet 2 of 4) Thermal/Mechanical Specifications and Design Guidelines... -
Page 100: Socket Mechanical Drawing (Sheet 3 Of 4)
Socket Mechanical Drawings Figure C-3. Socket Mechanical Drawing (Sheet 3 of 4) Thermal/Mechanical Specifications and Design Guidelines... -
Page 101: Socket Mechanical Drawing (Sheet 4 Of 4)
Socket Mechanical Drawings Figure C-4. Socket Mechanical Drawing (Sheet 4 of 4) § Thermal/Mechanical Specifications and Design Guidelines... - Page 102 Socket Mechanical Drawings Thermal/Mechanical Specifications and Design Guidelines...
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Page 103: D Package Mechanical Drawings
Package Mechanical Drawings Package Mechanical Drawings Table D-1 lists the mechanical drawings included in this appendix. Table D-1. Mechanical Drawing List Drawing Description Figure Number “Processor Package Drawing (Sheet 1 of 2)” Figure D-1 “Processor Package Drawing (Sheet 2 of 2)” Figure D-2 Thermal/Mechanical Specifications and Design Guidelines... -
Page 104: Processor Package Drawing (Sheet 1 Of 2)
Package Mechanical Drawings Figure D-1. Processor Package Drawing (Sheet 1 of 2) Thermal/Mechanical Specifications and Design Guidelines... -
Page 105: Processor Package Drawing (Sheet 2 Of 2)
Package Mechanical Drawings Figure D-2. Processor Package Drawing (Sheet 2 of 2) § Thermal/Mechanical Specifications and Design Guidelines... - Page 106 Package Mechanical Drawings Thermal/Mechanical Specifications and Design Guidelines...